Inventor · disambiguated record
Chien-Hung Liu
Also filed as: LIU CHIEN · LIU CHIEN H · LIU CHIEN HUNG · LIU CHIEN Y
206 granted patents·79 pending applications·1,309 citations·filing 2001–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD47XINTEC INC41MACRONIX INT CO LTD37LIU CHIEN-HUNG31HON HAI PREC IND CO LTD20
Top patents by PatentIndex Score
285 records- 0198US11177084B1Key structurePRIMAX ELECTRONICS LTD·Filed 2020·Granted Nov 16, 2021·7 cites·15 claims
- 0297USD487457STablet personal computerAPLUX COMM LTD·Filed 2003·Granted Mar 9, 2004·85 cites·1 claims
- 0397US6580630B1Initialization method of P-type silicon nitride read only memoryMACRONIX INT CO LTD·Filed 2002·Granted Jun 17, 2003·151 cites·11 claims
- 0496US10401970B1Keyboard device and manufacturing method thereofPRIMAX ELECTRONICS LTD·Filed 2018·Granted Sep 3, 2019·11 cites·15 claims
- 0596US6613632B2Fabrication method for a silicon nitride read-only memoryMACRONIX INT CO LTD·Filed 2002·Granted Sep 2, 2003·135 cites·21 claims
- 0696US6432778B1Method of forming a system on chip (SOC) with nitride read only memory (NROM)MACRONIX INT CO LTD·Filed 2001·Granted Aug 13, 2002·144 cites·11 claims
- 0795US9959994B1KeyboardPRIMAX ELECTRONICS LTD·Filed 2017·Granted May 1, 2018·8 cites·10 claims
- 0895US6469342B1Silicon nitride read only memory that prevents antenna effectMACRONIX INT CO LTD·Filed 2001·Granted Oct 22, 2002·143 cites·5 claims
- 0994US11978740B2Semiconductor-on-insulator (SOI) semiconductor structures including a high-k dielectric layer and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·2 cites·20 claims
- 1093US11801825B2Unmanned ground vehicle and method for operating unmanned ground vehicleGEOSAT AEROSPACE & TECH·Filed 2022·Granted Oct 31, 2023·2 cites·39 claims
- 1193US11575008B2Semiconductor arrangement and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·20 claims
- 1292US12414380B2Method for forming an integrated chip (IC) including forming a through substrate via (TSV) in an isolation structure formed in a first opening that formed in a metal substrate layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·1 cites·20 claims
- 1392US11574917B2Method of forming memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·20 claims
- 1490US9941068B2Key structurePRIMAX ELECTRONICS LTD·Filed 2016·Granted Apr 10, 2018·5 cites·12 claims
- 1589US11356012B2Transmission and distribution system with electric shock protection function and method of operating the sameDELTA ELECTRONICS INC·Filed 2020·Granted Jun 7, 2022·2 cites·16 claims
- 1689US10840333B2Semiconductor arrangement and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·3 cites·20 claims
- 1789US6413815B1Method of forming a MIM capacitorMACRONIX INT CO LTD·Filed 2001·Granted Jul 2, 2002·61 cites·9 claims
- 1888US11598751B2Resonance detection system for peripheral interface devicePRIMAX ELECTRONICS LTD·Filed 2021·Granted Mar 7, 2023·1 cites·20 claims
- 1988US8872196B2Chip packageXINTEC INC·Filed 2012·Granted Oct 28, 2014·5 cites·20 claims
- 2087US12402378B2Semiconductor arrangement including first and second gate electrodes and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 2187US8710680B2Electronic device package and fabrication method thereofCHANG SHU-MING·Filed 2011·Granted Apr 29, 2014·8 cites·13 claims
- 2287US8270180B2Printed circuit boardLIU CHIEN-HUNG·Filed 2009·Granted Sep 18, 2012·14 cites·3 claims
- 2386US12408439B2Integrated chip (IC) having conductive TSV extended through SOI substrate comprising a semiconductor device layer, an insulating layer and a metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 2, 2025·1 cites·20 claims
- 2486US10056419B2Chip package having chip connected to sensing device with redistribution layer in insulator layerXINTEC INC·Filed 2018·Granted Aug 21, 2018·4 cites·20 claims
- 2586US8476738B2Electronic package with stacked semiconductor chipsLIU CHIEN-HUNG·Filed 2010·Granted Jul 2, 2013·9 cites·22 claims
- 2686US8022309B2Flexible printed circuit boardHON HAI PREC IND CO LTD·Filed 2007·Granted Sep 20, 2011·13 cites·6 claims
- 2786US2025359337A1A low-cost semiconductor-on-insulator (soi) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2885US7981727B2Electronic device wafer level scale packages and fabrication methods thereofLIU CHIEN-HUNG·Filed 2007·Granted Jul 19, 2011·17 cites·10 claims
- 2985US7852478B1Detecting assembly for a multi-axis machine toolUNIV NAT FORMOSA·Filed 2010·Granted Dec 14, 2010·6 cites·13 claims
- 3084US11177083B1Key structurePRIMAX ELECTRONICS LTD·Filed 2021·Granted Nov 16, 2021·1 cites·17 claims
- 3184US11177092B1Keyboard device and key structure thereofPRIMAX ELECTRONICS LTD·Filed 2021·Granted Nov 16, 2021·1 cites·8 claims
- 3284US9941071B1Key structurePRIMAX ELECTRONICS LTD·Filed 2017·Granted Apr 10, 2018·3 cites·10 claims
- 3384US9935148B2Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layerXINTEC INC·Filed 2016·Granted Apr 3, 2018·4 cites·20 claims
- 3484US9715977B1Keyboard with height-adjustable keysPRIMAX ELECTRONICS LTD·Filed 2016·Granted Jul 25, 2017·3 cites·18 claims
- 3584US7636170B1Static/dynamic multi-function measuring device for linear unitUNIV NAT FORMOSA·Filed 2008·Granted Dec 22, 2009·17 cites·9 claims
- 3683US11894425B2Semiconductor arrangement and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 6, 2024·0 cites·20 claims
- 3783US10878915B1Memory device and method for programming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
- 3883US10510767B1Integrated circuit and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·2 cites·20 claims
- 3983US8508606B2System and method for deblurring motion blurred imagesLIU CHIEN-HUNG·Filed 2009·Granted Aug 13, 2013·7 cites·14 claims
- 4082US10755878B1Keyboard devicePRIMAX ELECTRONICS LTD·Filed 2019·Granted Aug 25, 2020·2 cites·11 claims
- 4182US10157875B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted Dec 18, 2018·4 cites·34 claims
- 4282US6440798B1Method of forming a mixed-signal circuit embedded NROM memory and MROM memoryMACRONIX INT CO LTD·Filed 2001·Granted Aug 27, 2002·26 cites·10 claims
- 4380US9543233B2Chip package having a dual through hole redistribution layer structureXINTEC INC·Filed 2015·Granted Jan 10, 2017·3 cites·9 claims
- 4480US8253509B2Printed circuit boardPAI YU-CHANG·Filed 2010·Granted Aug 28, 2012·5 cites·5 claims
- 4580US6818956B2Non-volatile memory device and fabrication method thereofMACRONIX INT CO LTD·Filed 2003·Granted Nov 16, 2004·22 cites·8 claims
- 4680US6666545B2Driver transistor structure of inkjet print head chip and the method for making the sameIND TECH RES INST·Filed 2002·Granted Dec 23, 2003·20 cites·7 claims
- 4780US6448126B1Method of forming an embedded memoryMACRONIX INT CO LTD·Filed 2001·Granted Sep 10, 2002·29 cites·11 claims
- 4880US2025359083A1Methods of forming ferromagnetic plates for enhancing inductanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4980US2024365552A1Method of manufacturing integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5079US8809933B2Bit line structure, semiconductor device and method of forming the sameLEE GUAN-DE·Filed 2010·Granted Aug 19, 2014·8 cites·10 claims
Showing the top 50 of 285 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →