Inventor · disambiguated record
Cheng-Yi Liu
Also filed as: LIU CHENG · LIU CHENG KUO · LIU CHENG-YI
33 granted patents·33 pending applications·464 citations·filing 2002–2025
96Inventor score
Top patents by PatentIndex Score
66 records- 0198US7420273B2Thinned die integrated circuit packageINTEL CORP·Filed 2005·Granted Sep 2, 2008·63 cites·16 claims
- 0298US6841413B2Thinned die integrated circuit packageINTEL CORP·Filed 2002·Granted Jan 11, 2005·196 cites·30 claims
- 0394US10573050B1Marker-based pose estimationSONY CORP·Filed 2018·Granted Feb 25, 2020·18 cites·20 claims
- 0493US10445898B2System and method for camera calibration by use of rotatable three-dimensional calibration objectSONY CORP·Filed 2016·Granted Oct 15, 2019·14 cites·22 claims
- 0592US8971712B2Carrier embedded optical radio-signal modulation of heterodyne optical carrier suppressionGEORGIA TECH RES INST·Filed 2013·Granted Mar 3, 2015·16 cites·24 claims
- 0691US7888183B2Thinned die integrated circuit packageINTEL CORP·Filed 2008·Granted Feb 15, 2011·17 cites·14 claims
- 0789US11743444B2Electronic device and method for temporal synchronization of videosSONY GROUP CORP·Filed 2021·Granted Aug 29, 2023·3 cites·18 claims
- 0887US10210615B2System and method for extrinsic camera parameters calibration by use of a three dimensional (3D) calibration objectSONY CORP·Filed 2016·Granted Feb 19, 2019·6 cites·19 claims
- 0986US6642079B1Process of fabricating flip chip interconnection structureUNIV NAT CENTRAL·Filed 2002·Granted Nov 4, 2003·50 cites·6 claims
- 1084US11256257B2Method of multi-drone camera controlSONY GROUP CORP·Filed 2020·Granted Feb 22, 2022·2 cites·20 claims
- 1183US11144766B2Method for fast visual data annotationSONY CORP·Filed 2019·Granted Oct 12, 2021·4 cites·15 claims
- 1281US11721030B2Method of autonomous hierarchical multi-drone image capturingSONY GROUP CORP·Filed 2021·Granted Aug 8, 2023·1 cites·20 claims
- 1381US8381964B2Tin-silver bonding and method thereofUNIV NAT CENTRAL·Filed 2012·Granted Feb 26, 2013·6 cites·13 claims
- 1481US2025357169A1Wafer transfer system and a method for transporting wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1578US8017962B2Light-emitting diode apparatus and manufacturing method thereofDELTA ELECTRONICS INC·Filed 2008·Granted Sep 13, 2011·6 cites·14 claims
- 1677US6744142B2Flip chip interconnection structure and process of making the sameUNIV NAT CENTRAL·Filed 2003·Granted Jun 1, 2004·27 cites·8 claims
- 1776US9947111B2Method of multiple camera positioning utilizing camera orderingSONY CORP·Filed 2015·Granted Apr 17, 2018·3 cites·24 claims
- 1873US2024387218A1Wafer transfer system and a method for transporting wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1972US12125727B2Wafer transfer system and a method for transporting wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 2070US7265389B2Light emitting diode and fabricating method thereofUNIV NAT CENTRAL·Filed 2005·Granted Sep 4, 2007·6 cites·17 claims
- 2167US12238412B2System and method to reduce an amount of sunlight and an amount of specular reflection in drone sensingSONY GROUP CORP·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 2265US2023203308A1Preparation method of branched polyamide (pa) copolymer with ultra-high toughness, pa copolymer prepared using the method, and use of the pa copolymerUNIV ANHUI AGRICULTURAL·Filed 2023·Application pending·0 cites
- 2363US12026917B2Method of 3D reconstruction of dynamic objects by mobile camerasSONY GROUP CORP·Filed 2022·Granted Jul 2, 2024·0 cites·22 claims
- 2461US2025234695A1Light-emitting diode moduleLEXTAR ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2559US6996272B2Apparatus and method for removing background on visualIND TECH RES INST·Filed 2002·Granted Feb 7, 2006·20 cites·20 claims
- 2659US2022363828A1Preparation method of reprocessable thermosetting polyesteramide (pea), and thermosetting pea prepared therebyUNIV ANHUI AGRICULTURAL·Filed 2022·Application pending·0 cites
- 2756US7291863B2Light emitting diode structureUNIV NAT CENTRAL·Filed 2005·Granted Nov 6, 2007·1 cites·21 claims
- 2853US2023321957A1Flexible bag, in particular an airbag for an oil expansion tank of a transformer, oil expansion tank and transformer comprising the same and method for producing the flexible bagHITACHI ENERGY SWITZERLAND AG·Filed 2022·Application pending·0 cites
- 2952US11365286B2Polyarylether-based polymer with side chain in methoxypolyethylene glycols structure, solid polymer electrolyte and preparation methods thereforUNIV DALIAN TECH·Filed 2021·Granted Jun 21, 2022·0 cites·23 claims
- 3051US8168455B2Method for manufacturing light emitting diodeLIU CHENG-YI·Filed 2009·Granted May 1, 2012·2 cites·18 claims
- 3151US2008014664A1Manufacturing method of light emitting diodeUNIV NAT CENTRAL·Filed 2007·Application pending·0 cites
- 3250US12167150B2Electronic device and method for spatial synchronization of videosSONY GROUP CORP·Filed 2021·Granted Dec 10, 2024·0 cites·19 claims
- 3350US2007158665A1Light emitting diodeUNIV NAT CENTRAL·Filed 2007·Application pending·0 cites
- 3449US8153461B2Light-emitting diode apparatus and manufacturing method thereofCHEN SHIH-PENG·Filed 2011·Granted Apr 10, 2012·0 cites·11 claims
- 3548US12094197B2Extraneous content removal from images of a scene captured by a multi-drone swarmSONY GROUP CORP·Filed 2021·Granted Sep 17, 2024·0 cites·15 claims
- 3647US9791264B2Method of fast and robust camera location orderingSONY CORP·Filed 2015·Granted Oct 17, 2017·0 cites·49 claims
- 3747US7507636B2Amorphous Si/Au eutectic wafer bonding structureUNIV NAT CENTRAL·Filed 2007·Granted Mar 24, 2009·0 cites·9 claims
- 3847US2010183896A1Tin-silver bonding and method thereofLIU CHENG-YI·Filed 2009·Application pending·0 cites
- 3946US2009039954A1Fan system and fan with filterLIU CHENG-YI·Filed 2008·Application pending·0 cites
- 4046US2005031483A1[solder composition]Filed 2004·Application pending·0 cites
- 4145US2008176354A1Method of uniform current distribution using current modified layerUNIV NAT CENTRAL·Filed 2007·Application pending·0 cites
- 4244US2008194077A1Method of low temperature wafer bonding through Au/Ag diffusionUNIV NAT CENTRAL·Filed 2007·Application pending·0 cites
- 4344US2015294950A1Method for ternary wafer bonding and structure thereofUNIV NAT CENTRAL·Filed 2014·Application pending·0 cites
- 4443US7295707B2Method for aligning gesture features of imageIND TECH RES INST·Filed 2003·Granted Nov 13, 2007·3 cites·14 claims
- 4543US2021407302A1System of multi-drone visual content capturingSONY GROUP CORP·Filed 2020·Application pending·0 cites
- 4643US2014054753A1Nano-meshed structure pattern on sapphire substrate by metal self-arrangementUNIV NAT CENTRAL·Filed 2013·Application pending·0 cites
- 4743US2014270479A1Systems and methods for parameter estimation of imagesSONY CORP·Filed 2013·Application pending·0 cites
- 4843US2015377435A1Illumination apparatus using sunlightUNIV NAT CENTRAL·Filed 2014·Application pending·0 cites
- 4942US11460867B2System of multi-swarm drone capturingSONY GROUP CORP·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 5042US9397256B2Light-emitting diode structure having progressive work function layerUNIV NAT CENTRAL·Filed 2014·Granted Jul 19, 2016·0 cites·8 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →