[solder composition]

Abstract

A solder composition adapted to bond metallic materials and non-metallic materials is provided. The solder composition can enhance the bonding strength for the metallic materials and the non-metallic materials. The solder composition mainly comprises Sn—Cr alloy. The solder composition further includes anther metal component for regulating the bonding capability so that the solder composition can be used to bond various materials.

1 . A solder composition, comprising: 
 chromium (Cr) in an amount of 5˜20 wt. %;    a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and a mixture thereof; and    an impurity.    
     
     
         2 . The solder composition according to  claim 1 , further comprising another component selected from a IVB group in the periodic table or a mixture thereof in an amount of 0.01˜10 wt. %.  
     
     
         3 . The solder composition according to  claim 1 , further comprising another component selected from a VB group in the periodic table or a mixture thereof in an amount of 0.01˜10 wt. %.  
     
     
         4 . The solder composition according to  claim 1 , further comprising another component selected from a IIIB group in the periodic table or a mixture thereof in an amount of 0.01˜20 wt. %.  
     
     
         5 . The solder composition according to  claim 4 , wherein the component selected from the IIIB group in the periodic table or a mixture thereof at least comprises cerium (Ce), samarium (Sm), neodymium (Nd), lutetium (Lu) or a mixture thereof.  
     
     
         6 . The solder composition according to  claim 1 , further comprising another component selected from silver (Ag), copper (Cu) or a mixture thereof having an amount of 0.01˜10 wt. %.  
     
     
         7 . The solder composition according to  claim 1 , further comprising stibium (Sb) in an amount of 0.01˜50 wt. %.  
     
     
         8 . The solder composition according to  claim 1 , further comprising another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01˜5 wt. %.  
     
     
         9 . The solder composition according to  claim 1 , further comprising gallium (Ga) in an amount of 0.01˜10 wt. %.  
     
     
         10 . A solder composition, comprising: 
 chromium (Cr) in an amount of 0.01˜5 wt. %;    a component selected from a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (In) and a mixture thereof; and    an impurity.    
     
     
         11 . The solder composition according to  claim 10 , further comprising another component selected from silver (Ag), copper (Cu) or a mixture thereof having an amount of 0.01˜10 wt. %.  
     
     
         12 . The solder composition according to  claim 10 , further comprising stibium (Sb) in an amount of 0.01˜50 wt. %.  
     
     
         13 . The solder composition according to  claim 10 , further comprising another component selected from nickel (Ni), cobalt (Co), manganese (Mn) or a mixture thereof in an amount of 0.01˜5 wt. %.  
     
     
         14 . The solder composition according to  claim 10 , further comprising gallium (Ga) in an amount of 0.01˜10 wt. %.