Inventor · disambiguated record
Chung-Hsien Liu
Also filed as: LIU CHUNG-HSIEN
11 granted patents·3 pending applications·10 citations·filing 2016–2025
82Inventor score
Top patents by PatentIndex Score
14 records- 0189US12402361B2Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Granted Aug 26, 2025·2 cites·20 claims
- 0280US10566337B2Method of manufacturing memory deviceWINBOND ELECTRONICS CORP·Filed 2018·Granted Feb 18, 2020·3 cites·10 claims
- 0379US10418440B2Memory structureWINBOND ELECTRONICS CORP·Filed 2017·Granted Sep 17, 2019·3 cites·10 claims
- 0477US10847612B2Method of manufacturing memory structureWINBOND ELECTRONICS CORP·Filed 2019·Granted Nov 24, 2020·2 cites·8 claims
- 0561US2025318131A1Flash memory and methods for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0655US2025212401A1Semiconductor memory device and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0755US2024349499A1Memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0854US10773953B2MEMS structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 15, 2020·0 cites·10 claims
- 0953US12119261B2Semiconductor structure and manufacturing method of the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 15, 2024·0 cites·19 claims
- 1051US9790088B2MEMS structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·0 cites·9 claims
- 1150US12176440B2Semiconductor structure with an air gap and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Dec 24, 2024·0 cites·19 claims
- 1247US10860404B2Server and debugging method thereforMITAC COMPUTING TECH CORP·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 1345US10497786B2Manufacturing method of semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2018·Granted Dec 3, 2019·0 cites·11 claims
- 1441US10381449B2Method of manufacturing memory deviceWINBOND ELECTRONICS CORP·Filed 2018·Granted Aug 13, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →