Inventor · disambiguated record
Changhua Liu
Also filed as: LIU CHANGHUA
16 granted patents·22 pending applications·8 citations·filing 2014–2024
86Inventor score
Top patents by PatentIndex Score
38 records- 0194US12164147B2Device, method and system for optical communication with a waveguide structure and an integrated optical coupler of a photonic integrated circuit chipINTEL CORP·Filed 2021·Granted Dec 10, 2024·3 cites·18 claims
- 0284US11088103B2First layer interconnect first on carrier approach for EMIB patchINTEL CORP·Filed 2018·Granted Aug 10, 2021·3 cites·20 claims
- 0376US12354992B2First layer interconnect first on carrier approach for EMIB patchINTEL CORP·Filed 2022·Granted Jul 8, 2025·0 cites·16 claims
- 0474US2023236517A1Method to achieve tilted patterning with a through resist thickness using projection opticsINTEL CORP·Filed 2023·Application pending·0 cites
- 0572US11837534B2Substrate with variable height conductive and dielectric elementsINTEL CORP·Filed 2017·Granted Dec 5, 2023·2 cites·7 claims
- 0670US12456705B2First layer interconnect first on carrier approach for EMIB patchINTEL CORP·Filed 2021·Granted Oct 28, 2025·0 cites·18 claims
- 0765US11644757B2Method to achieve tilted patterning with a through resist thickness using projection opticsINTEL CORP·Filed 2019·Granted May 9, 2023·0 cites·17 claims
- 0863US2024188489A1Lawn mowerPOSITEC POWER TOOLS SUZHOU CO LTD·Filed 2024·Application pending·0 cites
- 0962US12345932B2Die last and waveguide last architecture for silicon photonic packagingINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·19 claims
- 1059US2024184209A1Lithographic processes for making polymer-based elementsINTEL CORP·Filed 2022·Application pending·0 cites
- 1158US12341117B2Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substratesINTEL CORP·Filed 2021·Granted Jun 24, 2025·0 cites·25 claims
- 1258US11264307B2Dual-damascene zero-misalignment-via process for semiconductor packagingINTEL CORP·Filed 2019·Granted Mar 1, 2022·0 cites·20 claims
- 1357US12449600B2Position controlled waveguides and methods of manufacturing the sameINTEL CORP·Filed 2021·Granted Oct 21, 2025·0 cites·25 claims
- 1457US2024094746A1Multi-machine cooperation method, scheduling device, and multi-machine cooperation systemPOSITEC POWER TOOLS SUZHOU CO LTD·Filed 2023·Application pending·0 cites
- 1555US12298572B2Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structureINTEL CORP·Filed 2021·Granted May 13, 2025·0 cites·16 claims
- 1655US2024329339A1Photonic integrated circuit packages including replaceable fiber connectorsINTEL CORP·Filed 2023·Application pending·0 cites
- 1755US2024329333A1Co-packaging of photonic & electronic integrated circuit dieINTEL CORP·Filed 2023·Application pending·0 cites
- 1854US2024219629A1Photonic integrated circuits with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 1954US2024176070A1Photonic integrated circuit packages including substrates with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 2053US2024192453A1Photonic integrated circuit package substrate with vertical optical couplersINTEL CORP·Filed 2022·Application pending·0 cites
- 2153US2024112972A1Microelectronics packages with photo-integrated glass interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 2253US2025006645A1Microelectronic assemblies including a photoimageable dielectric for hybrid bonding and die encapsulationINTEL CORP·Filed 2023·Application pending·0 cites
- 2352US10078204B2Non-destructive 3-dimensional chemical imaging of photo-resist materialINTEL CORP·Filed 2014·Granted Sep 18, 2018·0 cites·36 claims
- 2452US2022272897A1Cutting assembly and lawn mowerPOSITEC POWER TOOLS SUZHOU CO LTD·Filed 2020·Application pending·0 cites
- 2552US2024113158A1High surface area capacitor in an electronic substrate packageINTEL CORP·Filed 2022·Application pending·0 cites
- 2651US10403564B2Dual-damascene zero-misalignment-via process for semiconductor packagingINTEL CORP·Filed 2017·Granted Sep 3, 2019·0 cites·36 claims
- 2751US2024162191A1Package substrate with alternating dielectric material layer pairsINTEL CORP·Filed 2022·Application pending·0 cites
- 2851US2024222130A1Enabling copper recess flattening through blocked copper etching processesINTEL CORP·Filed 2022·Application pending·0 cites
- 2951US2024111090A1Directly coupled optical interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 3050US2021318612A1Composite dry film resist for photolithographyINTEL CORP·Filed 2021·Application pending·0 cites
- 3149US2023091050A1Optical waveguides within a glass substrate to optically couple dies attached to the glass substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 3248US2022406618A1Technologies for aligned vias over multiple layersINTEL CORP·Filed 2021·Application pending·0 cites
- 3348US2022406654A1Technologies for aligned viasINTEL CORP·Filed 2021·Application pending·0 cites
- 3445US11506982B2Prism-mask for angled patterning applicationsINTEL CORP·Filed 2018·Granted Nov 22, 2022·0 cites·21 claims
- 3543US10438812B2Anisotropic etching systems and methods using a photochemically enhanced etchantINTEL CORP·Filed 2017·Granted Oct 8, 2019·0 cites·13 claims
- 3640US11586112B2Method to achieve tilted patterning with a through resist thicknessINTEL CORP·Filed 2018·Granted Feb 21, 2023·0 cites·22 claims
- 3740US2019339719A1Self-moving device and automatic working method of samePOSITEC POWER TOOLS SUZHOU CO LTD·Filed 2019·Application pending·0 cites
- 3838US2019169020A1Package substrate integrated devicesINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →