Inventor · disambiguated record
Chin-Kuan Liu
Also filed as: LIU CHIN-KUAN
4 granted patents·1 pending application·1 citations·filing 2008–2019
57Inventor score
Top patents by PatentIndex Score
5 records- 0165US10334719B2Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Jun 25, 2019·1 cites·18 claims
- 0257US11044806B2Method for manufacturing multi-layer circuit board capable of being applied with electrical testingKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 0352US10548214B2Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Jan 28, 2020·0 cites·20 claims
- 0450US10455694B2Method for manufacturing a multi-layer circuit board capable of being applied with electrical testingKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Oct 22, 2019·0 cites·20 claims
- 0539US2009225524A1Hollowed Printed Circuit Board Having Via Hole And Method For Forming Via Hole In Hollowed Printed Circuit BoardLIU CHIN-KUAN·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →