Inventor · disambiguated record
Cheng-Chung Lo
Also filed as: LO CHENG-CHUNG
7 granted patents·1 pending application·3 citations·filing 2016–2022
72Inventor score
Files withUNIMICRON TECHNOLOGY CORP8
Top patents by PatentIndex Score
8 records- 0191US11335670B2Light emitting diode package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted May 17, 2022·3 cites·11 claims
- 0272US11923350B2Light emitting diode package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 5, 2024·0 cites·6 claims
- 0370US11837591B2Manufacturing method of light emitting diode package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 5, 2023·0 cites·17 claims
- 0464US11991824B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 21, 2024·0 cites·3 claims
- 0550US11715715B2Metal bump structure and manufacturing method thereof and driving substrateUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 1, 2023·0 cites·14 claims
- 0644US2021251107A1Vapor chamber structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 0738US10070536B2Manufacturing method of circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Sep 4, 2018·0 cites·7 claims
- 0836US9917046B2Manufacturing method of a circuit board having a glass filmUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Mar 13, 2018·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →