Inventor · disambiguated record
Chong-Ren Maa
Also filed as: MAA CHONG-REN
8 granted patents·6 pending applications·111 citations·filing 1997–2004
88Inventor score
Files withS & S TECHNOLOGY CORP5APACK TECHNOLOGIES INC2ULTRATERA CORP2NANO ELECTRONICS AND MICRO SYS1UNITED TEST CT INC1
Top patents by PatentIndex Score
14 records- 0180US6753480B2Printed circuit board having permanent solder maskULTRATERA CORP·Filed 2002·Granted Jun 22, 2004·30 cites·13 claims
- 0270US6190943B1Chip scale packaging methodUNITED TEST CT INC·Filed 2000·Granted Feb 20, 2001·26 cites·3 claims
- 0366US6933448B2Printed circuit board having permanent solder maskS & S TECHNOLOGY CORP·Filed 2004·Granted Aug 23, 2005·14 cites·8 claims
- 0464US6395625B1Method for manufacturing solder mask of printed circuit boardS & S TECHNOLOGY CORP·Filed 2001·Granted May 28, 2002·11 cites·8 claims
- 0556US6458514B1Process for forming through holes in substrate of printed circuit boardFiled 2000·Granted Oct 1, 2002·9 cites·4 claims
- 0646US7080447B2Method of manufacturing solder mask of printed circuit boardULTRATERA CORP·Filed 2004·Granted Jul 25, 2006·2 cites·13 claims
- 0738US6221689B1Method for improving the reliability of underfill process for a chipAPACK TECHNOLOGIES INC·Filed 1997·Granted Apr 24, 2001·10 cites·9 claims
- 0836US2003072927A1Method for manufacturing solder mask of printed circuit boardS & S TECHNOLOGY CORP·Filed 2002·Application pending·0 cites
- 0936US2003071014A1Method for manufacturing solder mask of printed circuit boardS & S TECHNOLOGY CORP·Filed 2002·Application pending·0 cites
- 1034US6258622B1Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging methodAPACK TECHNOLOGIES INC·Filed 1999·Granted Jul 10, 2001·9 cites·11 claims
- 1134US2003201544A1Flip chip packageFiled 2002·Application pending·0 cites
- 1234US2003205793A1Wire-bonded chip on board packageFiled 2002·Application pending·0 cites
- 1334US2004007386A1Structure of printed circuit board (PCB)S & S TECHNOLOGY CORP·Filed 2002·Application pending·0 cites
- 1425US2003184234A1Electrode device for a plasma processing systemNANO ELECTRONICS AND MICRO SYS·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →