Inventor · disambiguated record
Chan Boon Meng
Also filed as: MENG CHAN BOON
8 granted patents·2 pending applications·43 citations·filing 2001–2013
85Inventor score
Technology areasH10W
Files withCARSEM M SDN BHD4WAI YONG LAM3CARSEM SEMICONDUCTOR SDN BHD1CARSEN SEMICONDUCTOR SDN BHD1MENG CHAN BOON1
Top patents by PatentIndex Score
10 records- 0186US8674488B2Light emitting diode (LED) packagesCARSEM M SDN BHD·Filed 2013·Granted Mar 18, 2014·9 cites·19 claims
- 0286US8314479B2Leadframe package with recessed cavity for LEDWAI YONG LAM·Filed 2011·Granted Nov 20, 2012·10 cites·19 claims
- 0383US8394675B2Manufacturing light emitting diode (LED) packagesWAI YONG LAM·Filed 2011·Granted Mar 12, 2013·8 cites·14 claims
- 0456US8535988B2Large panel leadframeWAI YONG LAM·Filed 2012·Granted Sep 17, 2013·1 cites·20 claims
- 0548US7288833B2Stress-free lead frameCARSEM M SDN BHD·Filed 2004·Granted Oct 30, 2007·5 cites·16 claims
- 0646US6867483B2Stress-free lead frameCARSEN SEMICONDUCTOR SDN BHD·Filed 2001·Granted Mar 15, 2005·7 cites·14 claims
- 0745US7786554B2Stress-free lead frameCARSEM M SDN BHD·Filed 2007·Granted Aug 31, 2010·0 cites·11 claims
- 0842US6544817B2Method for sawing a moulded leadframe packageCARSEM SEMICONDUCTOR SDN BHD·Filed 2001·Granted Apr 8, 2003·3 cites·1 claims
- 0939US2014021491A1Multi-compound moldingCARSEM M SDN BHD·Filed 2013·Application pending·0 cites
- 1035US2013200503A1Protective layers in semiconductor packagingMENG CHAN BOON·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →