Inventor · disambiguated record
Chuichi Miyazaki
Also filed as: MIYAZAKI CHUICHI
42 granted patents·13 pending applications·638 citations·filing 1991–2018
98Inventor score
Files withHITACHI LTD17RENESAS TECH CORP14RENESAS ELECTRONICS CORP8ABE YOSHIYUKI4AKITA ELECTRONICS SYSTEMS CO L1
Top patents by PatentIndex Score
55 records- 0195US7892949B2Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting regionRENESAS ELECTRONICS CORP·Filed 2006·Granted Feb 22, 2011·31 cites·5 claims
- 0295US7420284B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·39 cites·9 claims
- 0394US7737001B2Semiconductor manufacturing methodRENESAS TECH CORP·Filed 2006·Granted Jun 15, 2010·20 cites·9 claims
- 0494US6521981B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Feb 18, 2003·37 cites·18 claims
- 0594US6342728B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jan 29, 2002·38 cites·12 claims
- 0692US6670215B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Dec 30, 2003·28 cites·4 claims
- 0792US6472727B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Oct 29, 2002·31 cites·20 claims
- 0891US7091620B2Semiconductor device and manufacturing method thereofAKITA ELECTRONICS SYSTEMS CO L·Filed 2005·Granted Aug 15, 2006·21 cites·20 claims
- 0991US6342726B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted Jan 29, 2002·42 cites·9 claims
- 1088US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 1186US6642083B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 4, 2003·17 cites·10 claims
- 1285US6365439B2Method of manufacturing a ball grid array type semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 2, 2002·17 cites·19 claims
- 1383US8883566B2Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structureROHM CO LTD·Filed 2014·Granted Nov 11, 2014·5 cites·5 claims
- 1483US6355500B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·14 cites·15 claims
- 1582US8084334B2Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting regionABE YOSHIYUKI·Filed 2011·Granted Dec 27, 2011·4 cites·5 claims
- 1682US5141318ALaser interferometer type length measuring apparatus and positioning method using the sameHITACHI LTD·Filed 1991·Granted Aug 25, 1992·44 cites·10 claims
- 1781US10002808B2Semiconductor device manufacturing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 19, 2018·2 cites·19 claims
- 1877US7514294B2Semiconductor device and a manufacturing method of the sameRENESAS TECH CORP·Filed 2006·Granted Apr 7, 2009·5 cites·6 claims
- 1974US8518744B2Method of manufacturing semiconductor deviceKIKUCHI TAKASHI·Filed 2011·Granted Aug 27, 2013·3 cites·2 claims
- 2074US7759224B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Jul 20, 2010·4 cites·5 claims
- 2174US7265035B2Semiconductor device and its manufacturing methodRENESAS TECH CORP·Filed 2003·Granted Sep 4, 2007·18 cites·10 claims
- 2272US8729698B2Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structureMORIFUJI TADAHIRO·Filed 2010·Granted May 20, 2014·3 cites·6 claims
- 2372US6916686B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2003·Granted Jul 12, 2005·20 cites·17 claims
- 2471US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 2571US6664135B2Method of manufacturing a ball grid array type semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Dec 16, 2003·7 cites·16 claims
- 2669US9070560B2Semiconductor chip with modified regions for dividing the chipRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 30, 2015·1 cites·18 claims
- 2768US7795741B2Semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Sep 14, 2010·3 cites·9 claims
- 2868US7148081B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Dec 12, 2006·14 cites·9 claims
- 2968US6353255B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 5, 2002·6 cites·7 claims
- 3068US6307269B1Semiconductor device with chip size packageHITACHI LTD·Filed 1998·Granted Oct 23, 2001·32 cites·23 claims
- 3167US6515371B2Semiconductor device with elastic structure and wiringHITACHI LTD·Filed 2001·Granted Feb 4, 2003·13 cites·8 claims
- 3266US8546244B2Method of manufacturing semiconductor deviceABE YOSHIYUKI·Filed 2012·Granted Oct 1, 2013·2 cites·18 claims
- 3365US6433440B1Semiconductor device having a porous buffer layer for semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·24 cites·19 claims
- 3462US6355975B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·4 cites·15 claims
- 3561US7202570B2Circuit tape having adhesive film semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 10, 2007·6 cites·23 claims
- 3660US2018277456A1Semiconductor device manufacturing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3757US6639323B2Semiconductor device and its manufacturing methodHITACHI LTD·Filed 2001·Granted Oct 28, 2003·6 cites·29 claims
- 3855US7452787B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Nov 18, 2008·4 cites·35 claims
- 3955US2009191667A1semiconductor device and a manufacturing method of the sameRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 4054US2015235973A1Semiconductor device manufacturing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 4154US2013143359A1Semiconductor device and a manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 4252US8772135B2Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereofABE YOSHIYUKI·Filed 2011·Granted Jul 8, 2014·0 cites·14 claims
- 4351US7038325B2Wiring tape for semiconductor device including a buffer layer having interconnected foamsRENESAS TECH CORP·Filed 2004·Granted May 2, 2006·3 cites·9 claims
- 4449US2010213594A1Semiconductor device and a manufacturing method of the sameRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 4548US7923292B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Apr 12, 2011·0 cites·5 claims
- 4646US6645794B2Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer moldingHITACHI LTD·Filed 2002·Granted Nov 11, 2003·2 cites·3 claims
- 4745US2007141752A1Manufacturing method of semiconductor integrated circuit deviceABE YOSHIYUKI·Filed 2006·Application pending·0 cites
- 4843US2007114672A1Semiconductor device and method of manufacturing the sameHIGASHINO TOMOKO·Filed 2006·Application pending·0 cites
- 4940US2002160185A1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameFiled 2002·Application pending·0 cites
- 5040US2005260829A1Manufacturing method of a semiconductor deviceUEMATSU TOSHIHIDE·Filed 2005·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →