Inventor · disambiguated record
Christopher M. Neumann
Also filed as: NEUMANN CHRISTOPHER · NEUMANN CHRISTOPHER M
4 granted patents·14 pending applications·9 citations·filing 2016–2025
69Inventor score
Top patents by PatentIndex Score
18 records- 0196US11996411B2Stacked forksheet transistorsINTEL CORP·Filed 2020·Granted May 28, 2024·4 cites·21 claims
- 0295US12243875B2Forksheet transistors with dielectric or conductive spineINTEL CORP·Filed 2024·Granted Mar 4, 2025·2 cites·20 claims
- 0390US11923370B2Forksheet transistors with dielectric or conductive spineINTEL CORP·Filed 2020·Granted Mar 5, 2024·2 cites·20 claims
- 0474US2025185363A1Forksheet transistors with dielectric or conductive spineINTEL CORP·Filed 2025·Application pending·0 cites
- 0573US2024234422A1Stacked forksheet transistorsINTEL CORP·Filed 2024·Application pending·0 cites
- 0663US9583702B2Graphene-inserted phase change memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 28, 2017·1 cites·17 claims
- 0760US2025379140A1Device, method and system for providing (anti)ferroelectric capacitors of various thicknessesINTEL CORP·Filed 2024·Application pending·0 cites
- 0857US2025220932A1Defect self-compensation materials for high endurance (anti-)ferroelectric capacitors with hafnium oxide based material systemsINTEL CORP·Filed 2023·Application pending·0 cites
- 0956US2025220921A1Enhancing device performance by mitigation of oxygen migration in hafnium oxide based material systemsINTEL CORP·Filed 2023·Application pending·0 cites
- 1055US2024114695A1High endurance super-lattice anti-ferroelectric capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 1154US2024114693A1Self-aligned patterning of plate lines in three-dimensional ferroelectric capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 1252US2024112714A1Selective ferroelectric deployment for single-transistor, multiple-capacitor devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1352US2024114694A1Ferroelectric capacitor within backside interconnectINTEL CORP·Filed 2022·Application pending·0 cites
- 1452US2024114696A1Improved replacement electrode process for 3d ferroelectric memoryINTEL CORP·Filed 2022·Application pending·0 cites
- 1551US2023097641A1Ferroelectric three-dimensional memoryINTEL CORP·Filed 2021·Application pending·0 cites
- 1650US2023197777A1Source or drain metallization prior to contact formation in stacked transistorsINTEL CORP·Filed 2021·Application pending·0 cites
- 1749US2023100860A1Memory devices with reduced read disturbance effectsINTEL CORP·Filed 2021·Application pending·0 cites
- 1846US2023101111A1Three-dimensional ferroelectric random access memory (3d fram) with improved scalingINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →