Inventor · disambiguated record
Cheong Chiang Ng
Also filed as: NG CHEONG CHIANG · NG CHEONG H
3 granted patents·2 pending applications·15 citations·filing 2003–2022
58Inventor score
Top patents by PatentIndex Score
5 records- 0179US8163604B2Integrated circuit package system using etched leadframeONG YOU YANG·Filed 2005·Granted Apr 24, 2012·15 cites·20 claims
- 0256US12119316B2Patterned and planarized under-bump metallizationNXP USA INC·Filed 2022·Granted Oct 15, 2024·0 cites·18 claims
- 0349US2014345117A1Semiconductor device with thermal dissipation lead frameVERMA CHETAN·Filed 2014·Application pending·0 cites
- 0447US8836092B2Semiconductor device with thermal dissipation lead frameFREESCALE SEMICONDUCTOR INC·Filed 2012·Granted Sep 16, 2014·0 cites·8 claims
- 0529US2005126686A1Combination back grind tape and underfill for flip chipsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →