Inventor · disambiguated record
Chih-Hsien Ni
Also filed as: NI CHIH-HSIEN
4 granted patents·4 citations·filing 2012–2013
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0163US8704345B2Semiconductor package and lead frame thereofKUO CHIH-MING·Filed 2012·Granted Apr 22, 2014·2 cites·7 claims
- 0263US8658466B2Semiconductor package structure and method for making the sameHSIEH CHIN-TANG·Filed 2012·Granted Feb 25, 2014·2 cites·13 claims
- 0348US9159660B2Semiconductor package structure and method for making the sameCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Oct 13, 2015·0 cites·10 claims
- 0438US8581384B2Semiconductor package structureHSIEH CHIN-TANG·Filed 2012·Granted Nov 12, 2013·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →