Inventor · disambiguated record
Chien-Kee Pang
Also filed as: PANG CHIEN-KEE
10 granted patents·1 pending application·28 citations·filing 2007–2023
82Inventor score
Files withUNITED MICROELECTRONICS CORP11
Top patents by PatentIndex Score
11 records- 0192US10580823B2Wafer level packaging methodUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 3, 2020·21 cites·19 claims
- 0280US9780101B1Flash cell structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 3, 2017·5 cites·18 claims
- 0373US12266578B2Chips bonding auxiliary structureUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 1, 2025·0 cites·8 claims
- 0472US9852912B1Method of manufacturing semiconductor device for reducing grain size of polysiliconUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 26, 2017·2 cites·17 claims
- 0570US12249607B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2023·Granted Mar 11, 2025·0 cites·6 claims
- 0666US11456221B2Method for measuring chips bonding strength and chips bonding auxiliary structureUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 27, 2022·0 cites·12 claims
- 0763US11605648B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 14, 2023·0 cites·9 claims
- 0858US12278210B2Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 15, 2025·0 cites·12 claims
- 0952US12419081B2Silicon-on-insulator substrate and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 16, 2025·0 cites·4 claims
- 1044US10622253B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 14, 2020·0 cites·15 claims
- 1139US2008200039A1Nitridation processUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →