Inventor · disambiguated record
Chun-Hung Peng
Also filed as: PENG CHUN-HUNG
7 granted patents·121 citations·filing 1996–2001
86Inventor score
Files withWINBOND ELECTRONICS CORP3UNITED MICROELECTRONICS CORP2HOLTEK MICROELECTRONICS INC1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
7 records- 0185US6518148B1Method for protecting STI structures with low etching rate linersTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 11, 2003·48 cites·20 claims
- 0251US6080674AMethod for forming via holesUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 27, 2000·18 cites·17 claims
- 0347US6004851AMethod for manufacturing MOS device with adjustable source/drain extensionsHOLTEK MICROELECTRONICS INC·Filed 1998·Granted Dec 21, 1999·15 cites·19 claims
- 0445US5977598AHigh load resistance implemented in a separate polysilicon layer with diffusion barrier therein for preventing load punch through therefromWINBOND ELECTRONICS CORP·Filed 1997·Granted Nov 2, 1999·12 cites·4 claims
- 0543US6187668B1Method of forming self-aligned unlanded via holesUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 13, 2001·11 cites·17 claims
- 0642US5986310AProlonging a polysilicon layer in smaller memory cells to prevent polysilicon load punch throughWINBOND ELECTRONICS CORP·Filed 1997·Granted Nov 16, 1999·11 cites·8 claims
- 0729US5910452AMethod for reducing antenna effect during plasma etching procedure for semiconductor device fabricationWINBOND ELECTRONICS CORP·Filed 1996·Granted Jun 8, 1999·6 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →