Inventor · disambiguated record
Changhao Quan
Also filed as: QUAN CHANGHAO
5 granted patents·5 pending applications·2 citations·filing 2021–2024
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0191US11820058B2Injection mould and injection moulding methodCHANGXIN MEMORY TECH INC·Filed 2021·Granted Nov 21, 2023·2 cites·13 claims
- 0258US2025349756A1Semiconductor structure, semiconductor apparatus, and method for manufacturing semiconductor structureCXMT CORP·Filed 2024·Application pending·0 cites
- 0354US12444727B2Semiconductor package structure and manufacturing methodCHANGXIN MEMORY TECH INC·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0451US2023395441A1Package structure and method for manufacturing same, semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0550US12186952B2Injection mould and injection moulding methodCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 7, 2025·0 cites·6 claims
- 0650US11342236B2Wafer, semiconductor device and method for manufacturing the sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted May 24, 2022·0 cites·9 claims
- 0749US12512447B2Semiconductor package assembly and manufacturing methodCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 30, 2025·0 cites·14 claims
- 0849US2024014189A1Semiconductor package structure and manufacturing methodCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0948US2021343548A1Package structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 1048US2023014834A1Semiconductor packageCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →