Inventor · disambiguated record
Chandrasekaram Ramiah
Also filed as: RAMIAH CHANDRASEKARAM
13 granted patents·3 pending applications·293 citations·filing 1993–2017
93Inventor score
Files withFREESCALE SEMICONDUCTOR INC5INVENSAS CORP3MOTOROLA INC3APPLIED MATERIALS INC2SANDERS PAUL W2
Top patents by PatentIndex Score
16 records- 0192US8344503B23-D circuits with integrated passive devicesFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jan 1, 2013·18 cites·15 claims
- 0291US9698131B2Methods of forming 3-D circuits with integrated passive devicesINVENSAS CORP·Filed 2015·Granted Jul 4, 2017·6 cites·24 claims
- 0390US7935571B2Through substrate vias for back-side interconnections on very thin semiconductor wafersFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted May 3, 2011·18 cites·10 claims
- 0490US5639687AMethod for forming an integrated circuit pattern on a semiconductor substrate using silicon-rich silicon nitrideMOTOROLA INC·Filed 1996·Granted Jun 17, 1997·90 cites·20 claims
- 0589US7803714B2Semiconductor through silicon vias of variable size and method of formationFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Sep 28, 2010·19 cites·14 claims
- 0684US8283207B2Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methodsRAMIAH CHANDRASEKARAM·Filed 2011·Granted Oct 9, 2012·9 cites·20 claims
- 0784US5378659AMethod and structure for forming an integrated circuit pattern on a semiconductor substrateMOTOROLA INC·Filed 1993·Granted Jan 3, 1995·69 cites·34 claims
- 0880US8329579B2Through substrate VIASSANDERS PAUL W·Filed 2011·Granted Dec 11, 2012·5 cites·17 claims
- 0976US8062975B2Through substrate viasSANDERS PAUL W·Filed 2009·Granted Nov 22, 2011·6 cites·8 claims
- 1071US5539249AMethod and structure for forming an integrated circuit pattern on a semiconductor substrateMOTOROLA INC·Filed 1994·Granted Jul 23, 1996·36 cites·25 claims
- 1158US9837299B2Methods of forming 3-D circuits with integrated passive devicesINVENSAS CORP·Filed 2017·Granted Dec 5, 2017·0 cites·21 claims
- 1258US9236365B2Methods of forming 3-D circuits with integrated passive devicesINVENSAS CORP·Filed 2014·Granted Jan 12, 2016·0 cites·24 claims
- 1353US6345589B1Method and apparatus for forming a borophosphosilicate filmAPPLIED MATERIALS INC·Filed 1998·Granted Feb 12, 2002·17 cites·20 claims
- 1446US2010105168A1Microelecronic assembly and method for forming the sameFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1543US2008182363A1Method for forming a microelectronic assembly including encapsulating a die using a sacrificial layerFREESCALE SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 1641US2002090467A1Method and apparatus for forming a borophosphosilicate filmAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →