Inventor · disambiguated record
Christopher P. Schaffer
Also filed as: SCHAFFER CHRISTOPHER · SCHAFFER CHRISTOPHER P
17 granted patents·4 pending applications·250 citations·filing 2000–2013
94Inventor score
Top patents by PatentIndex Score
21 records- 0195US8591262B2Substrate inductive devices and methodsSCHAFFER CHRISTOPHER P·Filed 2010·Granted Nov 26, 2013·30 cites·19 claims
- 0293US7942700B2Modular electronic header assembly and methods of manufacturePULSE ENG INC·Filed 2010·Granted May 17, 2011·10 cites·20 claims
- 0393US7301235B2Semiconductor device module with flip chip devices on a common lead frameINT RECTIFIER CORP·Filed 2005·Granted Nov 27, 2007·41 cites·17 claims
- 0490US8860543B2Wire-less inductive devices and methodsSCHAFFER CHRISTOPHER P·Filed 2007·Granted Oct 14, 2014·20 cites·14 claims
- 0590US8234778B2Substrate inductive devices and methodsSCHAFFER CHRISTOPHER P·Filed 2011·Granted Aug 7, 2012·9 cites·22 claims
- 0690US7845984B2Power-enabled connector assembly and method of manufacturingPULSE ENG INC·Filed 2009·Granted Dec 7, 2010·20 cites·15 claims
- 0789US8845367B2Modular electronic header assembly and methods of manufacturePULSE ELECTRONICS INC·Filed 2013·Granted Sep 30, 2014·6 cites·20 claims
- 0888US7982572B2Substrate inductive devices and methodsPULSE ENG INC·Filed 2009·Granted Jul 19, 2011·12 cites·22 claims
- 0987US6946740B2High power MCM packageINT RECTIFIER CORP·Filed 2003·Granted Sep 20, 2005·49 cites·27 claims
- 1078US8118619B2Power-enabled connector assembly and method of manufacturingSCHAFFER CHRISTOPHER P·Filed 2010·Granted Feb 21, 2012·5 cites·26 claims
- 1174US7708602B2Connector keep-out apparatus and methodsPULSE ENG INC·Filed 2008·Granted May 4, 2010·15 cites·11 claims
- 1271US6534792B1Microelectronic device structure with metallic interlayer between substrate and dieBOEING CO·Filed 2000·Granted Mar 18, 2003·18 cites·11 claims
- 1365US8754734B2Simplified inductive devices and methodsSCHAFFER CHRISTOPHER P·Filed 2011·Granted Jun 17, 2014·1 cites·20 claims
- 1455US6489634B1Microelectronic device structure utilizing a diamond inlay in a package flangeBOEING CO·Filed 2001·Granted Dec 3, 2002·13 cites·20 claims
- 1554US2013033353A1Substrate inductive devices and methodsSCHAFFER CHRISTOPHER P·Filed 2012·Application pending·0 cites
- 1653US7745257B2High power MCM package with improved planarity and heat dissipationINT RECTIFIER CORP·Filed 2008·Granted Jun 29, 2010·0 cites·11 claims
- 1747US7453146B2High power MCM package with improved planarity and heat dissipationINT RECTIFIER CORP·Filed 2005·Granted Nov 18, 2008·0 cites·10 claims
- 1847US7355431B2Test arrangement including anisotropic conductive film for testing power moduleINT RECTIFIER CORP·Filed 2005·Granted Apr 8, 2008·1 cites·4 claims
- 1943US2013323974A1Substrate-based inductive devices and methods of using and manufacturing the samePULSE ELECTRONICS INC·Filed 2013·Application pending·0 cites
- 2041US2006202320A1Power semiconductor packageSCHAFFER CHRISTOPHER P·Filed 2006·Application pending·0 cites
- 2138US2002182975A1Sports demonstration figureFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →