Substrate inductive devices and methods

Abstract

Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.

1 .- 25 . (canceled) 
     
     
         26 . An integrated inductive device, comprising:
 a pair of substrates each comprised of an exterior surface which is at least partly plated with a conductive material, wherein the pair of substrates each have one or more winding portions formed thereon;   a plurality of conductors configured to electrically couple a given one of the pair of substrates with another one of the pair of substrates, with at least a portion of the plurality of conductors coupled to the exterior conductively plated surfaces of the pair of substrates; and   a plurality of magnetically permeable cores disposed at least partly between the pair of substrates, the plurality of magnetically permeable cores in combination with the pair of substrates and the conductors form a complete filter circuit;   wherein the pair of substrates are spaced apart a first distance thereby at least partially exposing the plurality of magnetically permeable cores.   
     
     
         27 . The integrated inductive device of  claim 26 , wherein the pair of substrates further includes an incorporated electronic component. 
     
     
         28 . The integrated inductive device of  claim 27 , wherein the one or more winding portions in combination with the plurality of magnetically permeable cores, the plurality of conductors, and the incorporated electronic component collectively forming the complete filter circuit. 
     
     
         29 . The integrated inductive device of  claim 26 , wherein the plurality of conductors are physically separated from the magnetically permeable cores. 
     
     
         30 . The integrated inductive device of  claim 29 , further comprising an insulating coating configured to improve electrical isolation between the magnetically permeable cores and adjacent ones of the conductors. 
     
     
         31 . The integrated inductive device of  claim 27 , wherein the incorporated electronic component is modeled into at least one of the pair of substrates. 
     
     
         32 . The integrated inductive device of  claim 27 , wherein the incorporated electronic component comprises a discrete electronic component mounted on a discrete mounting location on at least one of the pair of substrates. 
     
     
         33 . The integrated inductive device of  claim 32 , wherein the plurality of magnetically permeable cores comprise non-toroidal magnetically permeable cores. 
     
     
         34 . The integrated inductive device of  claim 27 , wherein the incorporated electronic component comprises a capacitive structure, the capacitive structure formed at least in part by disposing a plurality of capacitive surfaces on at least one of the pair of substrates, the plurality of capacitive surfaces being placed substantially parallel to one another. 
     
     
         35 . The integrated inductive device of  claim 26 , wherein the integrated inductive device comprises a modular jack. 
     
     
         36 . The integrated inductive device of  claim 35 , wherein the complete filter circuit comprises a Gigabit Ethernet (GBE) electronic circuit. 
     
     
         37 . An integrated inductive device, comprising:
 a pair of substrates, each comprised of an exterior surface which is at least partly conductively plated, with the pair of substrates having one or more winding portions formed thereon;   a plurality of conductors, at least a portion of the plurality of conductors extending from the exterior conductively plated surface and substantially through the substrate; and   a plurality of magnetically permeable cores, the cores disposed between the pair of substrates;   wherein the plurality of magnetically permeable cores in combination with the one or more winding portions and plurality of conductors form a functional filter circuit.   
     
     
         38 . The integrated inductive device of  claim 37 , wherein the plurality of conductors are physically separated from the magnetically permeable cores. 
     
     
         39 . The integrated inductive device of  claim 38 , further comprising an insulating coating configured to improve electrical isolation between the magnetically permeable cores and adjacent ones of the plurality of conductors. 
     
     
         40 . The integrated inductive device of  claim 39 , wherein the integrated inductive device comprises a modular jack. 
     
     
         41 . The integrated inductive device of  claim 40 , wherein the functional filter circuit comprises a Gigabit Ethernet (GBE) electronic circuit. 
     
     
         42 . The integrated inductive device of  claim 40 , wherein the plurality of conductors and the one or more winding portions are positioned in a repeatable manner with respect to individual ones of the plurality of magnetically permeable cores, the repeatable manner providing highly repeatable electronic performance for the functional filter circuit. 
     
     
         43 . An integrated inductive device comprising:
 a plurality of substrates, at least two of the substrates each comprised of an exterior surface which is at least partly plated with a conductive material, the at least two substrates having one or more winding portions formed thereon;   wherein at least one of the plurality of substrates further comprises an electronic component receiving pad;   an electronic component disposed on the electronic component receiving pad;   a plurality of conductors, at least a portion of the conductors extending from the exterior conductively plated surface and substantially through the respective substrate; and   a plurality of magnetically permeable cores disposed at least partly between the at least two substrates;   wherein the at least two substrates are spaced apart a first distance thereby providing at least partial access to the plurality of magnetically permeable cores; and   wherein, with the one or more winding portions in combination with the plurality of magnetically permeable cores, the electronic component and the conductors forming a functional filter circuit.   
     
     
         44 . The integrated inductive device of  claim 43 , wherein the integrated inductive device comprises a modular jack. 
     
     
         45 . The integrated inductive device of  claim 44 , wherein the plurality of conductors and the one or more winding portions are positioned in a repeatable manner with respect to individual ones of the plurality of magnetically permeable cores, the repeatable manner providing highly repeatable electronic performance for the modular jack.