Inventor · disambiguated record
Chien-Hsueh Shih
Also filed as: SHIH CHIEN HSUEH STEVE · SHIH CHIEN-HSUEH
16 granted patents·13 pending applications·104 citations·filing 2003–2012
92Inventor score
Top patents by PatentIndex Score
29 records- 0191US7538434B2Copper interconnection with conductive polymer layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 26, 2009·24 cites·23 claims
- 0291US7312531B2Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 25, 2007·22 cites·32 claims
- 0384US8193087B2Process for improving copper line cap formationSHIH CHIEN-HSUEH·Filed 2006·Granted Jun 5, 2012·10 cites·11 claims
- 0482US7777344B2Transitional interface between metal and dielectric in interconnect structuresTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Aug 17, 2010·9 cites·22 claims
- 0581US8349730B2Transitional interface between metal and dielectric in interconnect structuresTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 8, 2013·5 cites·18 claims
- 0679US8623760B2Process for improving copper line cap formationSHIH CHIEN-HSUEH·Filed 2012·Granted Jan 7, 2014·4 cites·16 claims
- 0774US7413976B2Uniform passivation method for conductive featuresTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Aug 19, 2008·4 cites·30 claims
- 0869US7182849B2ECP polymer additives and method for reducing overburden and defectsTAIWAN SEMICONDUCOTR MFG CO LT·Filed 2004·Granted Feb 27, 2007·8 cites·16 claims
- 0966US7332435B2Silicide structure for ultra-shallow junction for MOS devicesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 19, 2008·3 cites·18 claims
- 1063US7476306B2Method and apparatus for electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jan 13, 2009·8 cites·4 claims
- 1163US7446034B2Process for making a metal seed layerTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 4, 2008·1 cites·17 claims
- 1262US7582557B2Process for low resistance metal capTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 1, 2009·1 cites·19 claims
- 1360US8053892B2Low resistance and reliable copper interconnects by variable dopingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 8, 2011·1 cites·10 claims
- 1453US7026244B2Low resistance and reliable copper interconnects by variable dopingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 11, 2006·4 cites·8 claims
- 1549US2006213780A1Electroplating composition and methodTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1649US2006243599A1Electroplating additive for improved reliabilityTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1747US2005199507A1Chemical structures and compositions of ECP additives to reduce pit defectsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1846US2011204382A1Layered structures comprising silicon carbide layers, a process for their manufacture and their useBASE SE·Filed 2009·Application pending·0 cites
- 1945US8785321B2Low resistance and reliable copper interconnects by variable dopingKO TING-CHU·Filed 2011·Granted Jul 22, 2014·0 cites·20 claims
- 2045US2009004851A1Salicidation process using electroless plating to deposit metal and introduce dopant impuritiesTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 2145US2009117731A1Semiconductor interconnection structure and method for making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 2244US2011076416A1Method of making porous materials and porous materials prepared thereofBASF SE·Filed 2009·Application pending·0 cites
- 2342US2008251919A1Ultra-low resistance interconnectSHIH CHIEN-HSUEH·Filed 2007·Application pending·0 cites
- 2442US2007152306A1Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 2541US7771579B2Electro chemical plating additives for improving stress and leveling effectTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 10, 2010·0 cites·18 claims
- 2641US2007048991A1Copper interconnect structures and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 2739US2005211564A1Method and composition to enhance wetting of ECP electrolyte to copper seedTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 2838US2005045485A1Method to improve copper electrochemical depositionTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
- 2935US2006138668A1Passivation structure for semiconductor devicesSU HUNG-WEN·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chien-Hsueh Shih files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →