Inventor · disambiguated record
Chin Teck Siong
Also filed as: SIONG CHIN TECK
8 granted patents·4 pending applications·14 citations·filing 2012–2023
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0188US12288770B2Semiconductor packages with embedded wiring on re-distributed bumpsNXP BV·Filed 2022·Granted Apr 29, 2025·2 cites·10 claims
- 0278US8778704B1Solar powered IC chipLAU TECK BENG·Filed 2013·Granted Jul 15, 2014·6 cites·19 claims
- 0375US11056457B2Semiconductor device with bond wire reinforcement structureNXP USA INC·Filed 2018·Granted Jul 6, 2021·2 cites·15 claims
- 0472US8809078B1Solar powered IC chipLAU TECK BENG·Filed 2013·Granted Aug 19, 2014·4 cites·17 claims
- 0552US2025069903A1Semiconductor device with embedded leadframe and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0650US2023369168A1Package having metal skeleton frame using embedded ground planeNXP BV·Filed 2022·Application pending·0 cites
- 0744US2024014123A1Semiconductor device with lead-on-chip interconnect and method thereforNXP BV·Filed 2022·Application pending·0 cites
- 0843US10325826B1Substrate with reservoir for die attach adhesiveNXP USA INC·Filed 2018·Granted Jun 18, 2019·0 cites·17 claims
- 0943US9287236B2Flexible packaged integrated circuitLAU TECK BENG·Filed 2014·Granted Mar 15, 2016·0 cites·18 claims
- 1043US9257403B2Copper ball bond interface structure and formationFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Feb 9, 2016·0 cites·20 claims
- 1139US9165904B1Insulated wire bonding with EFO before second bondSIONG CHIN TECK·Filed 2014·Granted Oct 20, 2015·0 cites·14 claims
- 1228US2013319726A1Multi-core wireSIONG CHIN TECK·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →