Inventor · disambiguated record
Chung-Hui Su
Also filed as: SU CHUNG-HUI
19 granted patents·502 citations·filing 1994–1999
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG19
Top patents by PatentIndex Score
19 records- 0182US5677557AMethod for forming buried plug contacts on semiconductor integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Oct 14, 1997·61 cites·3 claims
- 0281US5480814AProcess of making a polysilicon barrier layer in a self-aligned contact moduleTAIWAN SEMICONDUCTOR MFG·Filed 1994·Granted Jan 2, 1996·70 cites·21 claims
- 0376US5545585AMethod of making a dram circuit with fin-shaped stacked capacitorsTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Aug 13, 1996·42 cites·24 claims
- 0476US5545584AUnified contact plug process for static random access memory (SRAM) having thin film transistorsTAIWAN SEMICONDUCTOR MFG·Filed 1995·Granted Aug 13, 1996·53 cites·32 claims
- 0573US5607879AMethod for forming buried plug contacts on semiconductor integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 1995·Granted Mar 4, 1997·40 cites·21 claims
- 0672US5547892AProcess for forming stacked contacts and metal contacts on static random access memory having thin film transistorsTAIWAN SEMICONDUCTOR MFG·Filed 1995·Granted Aug 20, 1996·35 cites·12 claims
- 0768US5587696AHigh resistance polysilicon resistor for integrated circuits and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 1995·Granted Dec 24, 1996·28 cites·15 claims
- 0867US5716881AProcess to fabricate stacked capacitor DRAM and low power thin film transistor SRAM devices on a single semiconductor chipTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Feb 10, 1998·32 cites·26 claims
- 0963US6093617AProcess to fabricate hemispherical grain polysiliconTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jul 25, 2000·23 cites·11 claims
- 1059US5576243AProcess for forming stacked contacts and metal contacts on static random access memory having thin film transistorsTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Nov 19, 1996·19 cites·5 claims
- 1158US5796135AProcess to fabricate stacked capacitor dram and low power thin film transistor sram devices on a single semiconductor chipTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Aug 18, 1998·20 cites·6 claims
- 1256US5652174AUnified stacked contact process for static random access memory (SRAM) having polysilicon load resistorsTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jul 29, 1997·15 cites·20 claims
- 1354US5867087AThree dimensional polysilicon resistor for integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Feb 2, 1999·15 cites·15 claims
- 1454US5837582AMethod to increase capacitance of a DRAM cellTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Nov 17, 1998·15 cites·18 claims
- 1547US5668380AReduced area metal contact to a thin polysilicon layer contact structure having low ohmic resistanceTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Sep 16, 1997·9 cites·3 claims
- 1645US6001731AIsolation dielectric deposition in multi-polysilicon chemical-mechanical polishing processTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Dec 14, 1999·10 cites·11 claims
- 1742US6222214B1Plug structure and process for forming stacked contacts and metal contacts on static random access memory thin film transistorsTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Apr 24, 2001·8 cites·5 claims
- 1835US6218286B1Isolation dielectric deposition in multi-polysilicon chemical-mechanical polishing processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Apr 17, 2001·4 cites·11 claims
- 1935US5534451AMethod for fabricating a reduced area metal contact to a thin polysilicon layer contact structure having low ohmic resistanceTAIWAN SEMICONDUCTOR MFG·Filed 1995·Granted Jul 9, 1996·3 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →