Inventor · disambiguated record
Ching Hwa Tey
Also filed as: TEY CHING-HWA
26 granted patents·8 pending applications·56 citations·filing 2002–2024
94Inventor score
Files withUNITED MICROELECTRONICS CORP29LIAO DUAN QUAN3KONINKL PHILIPS ELECTRONICS NV1TEY CHING-HWA1
Top patents by PatentIndex Score
34 records- 0196US12040224B2Transistor structure with air gap and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 16, 2024·3 cites·18 claims
- 0296US11355389B2Transistor structure with air gap and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jun 7, 2022·4 cites·16 claims
- 0390US9941161B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 10, 2018·7 cites·12 claims
- 0488US11641000B2Image sensor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 2, 2023·2 cites·20 claims
- 0587US12094758B2Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 17, 2024·2 cites·8 claims
- 0684US12176375B2Image sensor structure including nanowire structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 24, 2024·1 cites·10 claims
- 0782US12424487B2Transistor structure with air gap and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Sep 23, 2025·0 cites·9 claims
- 0882US9276057B2Capacitor structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 1, 2016·6 cites·12 claims
- 0982US2024395834A1Photosensitive semiconductor device including heterojunction photodiodeUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1078US12094896B2Photosensitive semiconductor device including heterojunction photodiodeUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 17, 2024·0 cites·17 claims
- 1178US12080734B2Photosensitive semiconductor device including heterojunction photodiodeUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 3, 2024·0 cites·3 claims
- 1278US9583594B2Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 28, 2017·2 cites·15 claims
- 1376US9685387B1Test key for checking the window of a doped region and method of using the test keyUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 20, 2017·2 cites·7 claims
- 1476US2025022905A1Manufacturing method of image sensor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1573US7113181B2Display device and method of changing the display settings thereofKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Sep 26, 2006·19 cites·2 claims
- 1670US9698229B2Semiconductor structure and process thereofLIAO DUAN QUAN·Filed 2012·Granted Jul 4, 2017·3 cites·4 claims
- 1767US11527561B2Photosensitive semiconductor device including top surface photodiodeUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 13, 2022·0 cites·15 claims
- 1867US9023726B1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 5, 2015·2 cites·20 claims
- 1966US10909299B1Method for stabilizing bandgap voltageUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 2, 2021·0 cites·10 claims
- 2065US9305887B2Seal ring structure with a v-shaped dielectric layer conformally overlapping a conductive layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 5, 2016·2 cites·8 claims
- 2165US2024105502A1Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2260US9401280B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 26, 2016·1 cites·18 claims
- 2357US2025366178A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2455US12433042B2Image sensor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 30, 2025·0 cites·28 claims
- 2554US2025031585A1Resistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2653US11101361B1Gate-all-around (GAA) transistor and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Aug 24, 2021·0 cites·20 claims
- 2750US11127621B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 21, 2021·0 cites·14 claims
- 2849US2017117150A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 2948US2017162450A1Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 3046US2010173466A1Method for fabricating a semiconductor deviceTEY CHING-HWA·Filed 2009·Application pending·0 cites
- 3143US11527605B2Method for fabricating metal-oxide-metal capacitorUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·8 claims
- 3239US10332839B2Interconnect structure and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 25, 2019·0 cites·18 claims
- 3339US8828878B2Manufacturing method for dual damascene structureLIAO DUAN QUAN·Filed 2011·Granted Sep 9, 2014·0 cites·17 claims
- 3436US8658487B2Semiconductor device and fabrication method thereofLIAO DUAN-QUAN·Filed 2011·Granted Feb 25, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →