Inventor · disambiguated record

Chia-Shiung Tsai

Also filed as: TSAI CHIA S · TSAI CHIA-SHIUNG

499 granted patents·38 pending applications·7,579 citations·filing 1994–2025

99Inventor score

Technology areasH10P H10W H10D H01L H10F

Files withTAIWAN SEMICONDUCTOR MFG CO LTD287 TAIWAN SEMICONDUCTOR MFG189 CHEN CHI-MING10 HSIEH YUAN-CHIH4 LIU PING-YIN4

Top patents by PatentIndex Score

537 records

0199US9711555B2Dual facing BSI image sensors with wafer level stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 18, 2017·31 cites·20 claims
0299US9355882B2Transfer module for bowed wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 31, 2016·391 cites·20 claims
0399US9257399B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·232 cites·19 claims
0499US8802538B1Methods for hybrid wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·269 cites·20 claims
0598US10103122B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·26 cites·20 claims
0698US9443796B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·221 cites·20 claims
0798US8872149B1RRAM structure and process using composite spacerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 28, 2014·61 cites·20 claims
0898US8809123B2Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Aug 19, 2014·238 cites·20 claims
0998US8476146B2Reducing wafer distortion through a low CTE layerCHEN CHI-MING·Filed 2010·Granted Jul 2, 2013·134 cites·20 claims
1098US6743732B1Organic low K dielectric etch with NH3 chemistryTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 1, 2004·249 cites·7 claims
1197US9960129B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 1, 2018·22 cites·17 claims
1297US8053856B1Backside illuminated sensor processingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 8, 2011·26 cites·19 claims
1397US6362012B1Structure of merged vertical capacitor inside spiral conductor for RF and mixed-signal applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 26, 2002·138 cites·23 claims
1497US6323121B1Fully dry post-via-etch cleaning method for a damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Nov 27, 2001·206 cites·22 claims
1597US6316348B1High selectivity Si-rich SiON etch-stop layerTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 13, 2001·175 cites·4 claims
1697US6271084B1Method of fabricating a metal-insulator-metal (MIM), capacitor structure using a damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 7, 2001·169 cites·24 claims
1797US6037266AMethod for patterning a polysilicon gate with a thin gate oxide in a polysilicon etcherTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Mar 14, 2000·283 cites·16 claims
1897US5575706AChemical/mechanical planarization (CMP) apparatus and polish methodTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Nov 19, 1996·255 cites·35 claims
1996US10790189B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·9 cites·20 claims
2096US10665449B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 26, 2020·5 cites·20 claims
2196US10134945B1Wafer to wafer bonding techniques for III-V wafers and CMOS wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·18 cites·20 claims
2296US10049890B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·15 cites·20 claims
2396US9853091B2Side bottom contact RRAM structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·16 cites·20 claims
2496US9793243B2Buffer layer(s) on a stacked structure having a viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 17, 2017·17 cites·20 claims
2596US9490158B2Bond chuck, methods of bonding, and tool including bond chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·15 cites·20 claims
2696US9431609B2Oxide film scheme for RRAM structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·30 cites·20 claims
2796US9257642B1Protective sidewall techniques for RRAMTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 9, 2016·18 cites·19 claims
2896US9196825B2Reversed stack MTJTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 24, 2015·13 cites·20 claims
2996US9048283B2Hybrid bonding systems and methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Jun 2, 2015·22 cites·20 claims
3096US9040951B2Resistance variable memory structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·13 cites·16 claims
3196US8816358B1Plasmonic nanostructures for organic image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 26, 2014·30 cites·20 claims
3295US11923237B2Manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
3395US11495489B2Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·3 cites·20 claims
3495US10614948B2Method for forming inductor structure with magnetic materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 7, 2020·3 cites·20 claims
3595US9728453B2Methods for hybrid wafer bonding integrated with CMOS processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·21 cites·19 claims
3695US9331032B2Hybrid bonding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 3, 2016·24 cites·20 claims
3795US9178144B1RRAM cell with bottom electrodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 3, 2015·25 cites·20 claims
3895US6514672B2Dry development process for a bi-layer resist systemTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 4, 2003·113 cites·13 claims
3994US10553474B1Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 4, 2020·6 cites·20 claims
4094US10354972B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 16, 2019·7 cites·20 claims
4194US9738516B2Structure to reduce backside silicon damageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 22, 2017·9 cites·20 claims
4294US9647207B2Resistive random access memory (RRAM) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 9, 2017·11 cites·20 claims
4394US9577191B2RRAM cell bottom electrode formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 21, 2017·11 cites·20 claims
4494US9219109B2Inductor structure with magnetic materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 22, 2015·4 cites·20 claims
4594US8143683B2In-situ formed capping layer in MTJ devicesWANG YUNG-HUNG·Filed 2010·Granted Mar 27, 2012·40 cites·18 claims
4694US7723128B2In-situ formed capping layer in MTJ devicesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted May 25, 2010·42 cites·18 claims
4793US10529916B2Reversed stack MTJTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·6 cites·20 claims
4893US10003022B2RRAM cell structure with conductive etch-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 19, 2018·8 cites·20 claims
4993US9281331B2High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 8, 2016·16 cites·12 claims
5093US9159723B2Method for manufacturing semiconductor device and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 13, 2015·22 cites·19 claims

Showing the top 50 of 537 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →