Inventor · disambiguated record
Chien-Cheng Tsai
Also filed as: TSAI CHIEN-CHENG
18 granted patents·6 pending applications·34 citations·filing 2016–2024
90Inventor score
Top patents by PatentIndex Score
24 records- 0193US10475794B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·17 cites·14 claims
- 0283US10153165B1Patterning methodUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 11, 2018·3 cites·10 claims
- 0383US10151048B1Manufacturing method of epitaxial contact structure in semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·5 cites·20 claims
- 0482US12272646B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Apr 8, 2025·0 cites·8 claims
- 0578US11233057B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 25, 2022·2 cites·11 claims
- 0676US10529719B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 7, 2020·2 cites·8 claims
- 0776US10381306B2Semiconductor memory device and a manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 13, 2019·1 cites·4 claims
- 0875US11769727B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 26, 2023·0 cites·13 claims
- 0973US10062700B2Semiconductor storage device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·2 cites·11 claims
- 1072US10658365B2Semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 19, 2020·1 cites·3 claims
- 1169US10263001B2Method of forming semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 16, 2019·1 cites·11 claims
- 1266US2025338509A1Semiconductor structure and manufacturing method for semiconductor structureFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 1365US11139243B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 5, 2021·0 cites·4 claims
- 1463US11882683B2Method of forming semiconductor memory device having saddle portionUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 23, 2024·0 cites·6 claims
- 1562US2025318197A1Semiconductor device and fabricating method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 1661US2025275200A1Semiconductor device and manufacturing method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 1760US2025201709A1Semiconductor device and method of manufacturing the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 1859US10861855B2Semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 8, 2020·0 cites·11 claims
- 1957US11758710B2Memory device and fabrication method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 2048US12274053B2Semiconductor structure and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·7 claims
- 2146US10204914B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 12, 2019·0 cites·8 claims
- 2245US2018286868A1Semiconductor memory device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 2337US10199258B2Method of fabricating isolation structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 5, 2019·0 cites·1 claims
- 2437US2019204748A1Method for removing patterned negative photoresistUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →