Inventor · disambiguated record
Chung-Che Tsai
Also filed as: TSAI CHUNG-CHE
17 granted patents·8 pending applications·444 citations·filing 2000–2020
94Inventor score
Top patents by PatentIndex Score
25 records- 0194US6713856B2Stacked chip package with enhanced thermal conductivityULTRATERA CORP·Filed 2002·Granted Mar 30, 2004·98 cites·7 claims
- 0293US6713857B1Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor packageULTRA TERA CORP·Filed 2002·Granted Mar 30, 2004·91 cites·20 claims
- 0388US6326700B1Low profile semiconductor package and process for making the sameUNITED TEST CT INC·Filed 2000·Granted Dec 4, 2001·81 cites·18 claims
- 0485US6849915B1Light sensitive semiconductor package and fabrication method thereofULTRA TERA CORP·Filed 2003·Granted Feb 1, 2005·43 cites·16 claims
- 0584US6683385B2Low profile stack semiconductor packageULTRATERA CORP·Filed 2002·Granted Jan 27, 2004·39 cites·22 claims
- 0680US6849932B2Double-sided thermally enhanced IC chip packageULTRATERA CORP·Filed 2002·Granted Feb 1, 2005·31 cites·15 claims
- 0778US11239179B2Semiconductor package and fabrication method thereofTSAI SHIANN TSONG·Filed 2020·Granted Feb 1, 2022·1 cites·31 claims
- 0873US6555919B1Low profile stack semiconductor packageULTRATERA CORP·Filed 2002·Granted Apr 29, 2003·20 cites·30 claims
- 0971US10923435B2Semiconductor package with in-package compartmental shielding and improved heat-dissipation performanceTSAI SHIANN TSONG·Filed 2020·Granted Feb 16, 2021·1 cites·14 claims
- 1062US6911604B2Bonding pads of printed circuit board capable of holding solder balls securelyULTRATERA CORP·Filed 2002·Granted Jun 28, 2005·10 cites·7 claims
- 1161US10847480B2Semiconductor package with in-package compartmental shielding and fabrication method thereofTSAI CHUNG CHE·Filed 2019·Granted Nov 24, 2020·1 cites·17 claims
- 1261US6857865B2Mold structure for package fabricationULTRATERA CORP·Filed 2002·Granted Feb 22, 2005·10 cites·11 claims
- 1360US6709894B2Semiconductor package and method for fabricating the sameULTRATERA CORP·Filed 2002·Granted Mar 23, 2004·10 cites·12 claims
- 1452US6968613B2Fabrication method of circuit boardULTRATERA CORP·Filed 2002·Granted Nov 29, 2005·4 cites·11 claims
- 1551US6740540B2Fabrication method for circuit boardULTRA TERA CORP·Filed 2002·Granted May 25, 2004·4 cites·22 claims
- 1643US10896880B2Semiconductor package with in-package compartmental shielding and fabrication method thereofTSAI SHIANN TSONG·Filed 2019·Granted Jan 19, 2021·0 cites·26 claims
- 1741US11211340B2Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shieldingTSAI SHIANN TSONG·Filed 2019·Granted Dec 28, 2021·0 cites·21 claims
- 1838US2020168557A1Semiconductor package and fabrication method thereofTSAI CHUNG CHE·Filed 2019·Application pending·0 cites
- 1938US2003184979A1Circuit board free of photo-sensitive material and fabrication method of the sameULTRATERA CORP·Filed 2002·Application pending·0 cites
- 2038US2004003940A1Circuit board for flip-chip semiconductor package and fabrication method thereofFiled 2002·Application pending·0 cites
- 2137US2005046003A1Stacked-chip semiconductor package and fabrication method thereofFiled 2003·Application pending·0 cites
- 2237US2005062152A1Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the sameFiled 2003·Application pending·0 cites
- 2337US2005062155A1Window ball grid array semiconductor package and method for fabricating the sameFiled 2003·Application pending·0 cites
- 2436US2003234276A1Strengthened bonding mechanism for semiconductor packageULTRATERA CORP·Filed 2002·Application pending·0 cites
- 2535US2004004277A1Semiconductor package with reinforced substrate and fabrication method of the substrateFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →