Inventor · disambiguated record
Chung-Chuan Tseng
Also filed as: TSENG CHUNG-CHUAN
48 granted patents·12 pending applications·61 citations·filing 2005–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD52TESSERA INC4INVENSAS CORP2GAO GUILIAN1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
60 records- 0197US10546917B1Trench capacitor layout structure and method of forming same backgroundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 28, 2020·22 cites·20 claims
- 0296US12057467B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·2 cites·18 claims
- 0396US11894411B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·2 cites·20 claims
- 0492US10777591B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·4 cites·21 claims
- 0591US11515355B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 0690US11488993B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·2 cites·20 claims
- 0790US10679889B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 9, 2020·5 cites·20 claims
- 0890US2025344525A1Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0989US12364028B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1089US2025359368A1Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1186US11581400B2Method of making a trench capacitor and trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·1 cites·20 claims
- 1283US12439713B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 1382US9281336B2Mechanisms for forming backside illuminated image sensor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 8, 2016·2 cites·20 claims
- 1481US11626442B2Methods for forming image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 11, 2023·1 cites·20 claims
- 1580US11329125B2Integrated circuit including trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 10, 2022·2 cites·20 claims
- 1680US9177914B2Metal pad structure over TSV to reduce shorting of upper metal layerTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 3, 2015·5 cites·20 claims
- 1780US2025151376A1Device including mim capacitor and resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1879US12211838B2Device including MIM capacitor and resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1979US12125868B2Image sensors with dummy pixel structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 2079US11784199B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 2178US2024371910A1Image Sensors With Dummy Pixel StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2277US2022384503A1Infrared image sensor component manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2376US12369420B2Methods for forming image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 2476US2023378218A1Methods for forming image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2575US12495558B2Integrated circuit including trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 2675US9673248B2Image sensing device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 6, 2017·3 cites·20 claims
- 2774US12514010B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 2873US10438838B2Semiconductor structure and related methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 8, 2019·1 cites·20 claims
- 2971US11996439B2Integrated circuit including trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 3071US11756955B2Device including MIM capacitor and resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 3170US11587824B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 3270US10854658B2Image sensor with sidewall protection and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 3369US9620551B2Mechanisms for forming backside illuminated image sensor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·1 cites·20 claims
- 3468US10847607B2Method of making a trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 24, 2020·0 cites·20 claims
- 3566US7964947B2Stacking packages with alignment elementsTESSERA INC·Filed 2006·Granted Jun 21, 2011·3 cites·10 claims
- 3665US11961866B2Method of making an image sensor with sidewall protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 16, 2024·0 cites·20 claims
- 3765US11476288B2Infrared image sensor component manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 18, 2022·0 cites·20 claims
- 3864US8946901B2Microelectronic package and method of manufacture thereofINVENSAS CORP·Filed 2013·Granted Feb 3, 2015·1 cites·23 claims
- 3963US11127625B2Semiconductor structure and related methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 4063US9530690B2Metal pad structure over TSV to reduce shorting of upper metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·1 cites·20 claims
- 4162US11670650B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·20 claims
- 4262US9524997B1Semiconductor device having seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·1 cites·20 claims
- 4362US2025364445A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4462US2025366280A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4561US9871067B2Infrared image sensor componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·0 cites·16 claims
- 4660US10453881B2Infrared image sensor componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 4758US11545518B2Image sensor and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 4858US9287303B1CMOS image sensor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 15, 2016·0 cites·20 claims
- 4956US9627249B2Semiconductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 18, 2017·0 cites·20 claims
- 5055US10553489B2Partitioned wafer and semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 4, 2020·0 cites·20 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Chung-Chuan Tseng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →