Inventor · disambiguated record
Christian Val
Also filed as: VAL CHRISTIAN · VERGNOLLE CLAUDE
42 granted patents·4 pending applications·1,367 citations·filing 1978–2021
98Inventor score
Top patents by PatentIndex Score
46 records- 0197US5461545AProcess and device for hermetic encapsulation of electronic componentsTHOMSON CSF·Filed 1994·Granted Oct 24, 1995·153 cites·12 claims
- 0295US5637536AMethod for interconnecting semiconductor chips in three dimensions, and component resulting therefromTHOMSON CSF·Filed 1994·Granted Jun 10, 1997·206 cites·21 claims
- 0394US8567051B2Process for the vertical interconnection of 3D electronic modules by viasVAL CHRISTIAN·Filed 2008·Granted Oct 29, 2013·28 cites·8 claims
- 0494US4654694AElectronic component box supplied with a capacitorINF MILIT SPATIALE AERONAUT·Filed 1984·Granted Mar 31, 1987·91 cites·7 claims
- 0592US7951649B2Process for the collective fabrication of 3D electronic modules3D PLUS·Filed 2007·Granted May 31, 2011·26 cites·20 claims
- 0687US7877874B2Process for the collective fabrication of 3D electronic modules3D PLUS·Filed 2006·Granted Feb 1, 2011·16 cites·20 claims
- 0786US5237204AElectric potential distribution device and an electronic component case incorporating such a deviceINF MILIT SPATIALE AERONAUT·Filed 1991·Granted Aug 17, 1993·87 cites·17 claims
- 0885US4413170AThermal printing headTHOMSON CSF·Filed 1981·Granted Nov 1, 1983·33 cites·6 claims
- 0983US7476965B2Electronic device with integrated heat distributor3D PLUS·Filed 2005·Granted Jan 13, 2009·19 cites·20 claims
- 1082US6716672B2Three dimensional interconnection method and electronic device obtained by same3D PLUS·Filed 2001·Granted Apr 6, 2004·32 cites·12 claims
- 1181US4559579ADevice for the protection of an electronic component and/or circuit against the disturbances (voltages) generated by an external electromagnetic fieldTHOMSON CSF·Filed 1983·Granted Dec 17, 1985·46 cites·10 claims
- 1280US6809367B2Device for interconnecting, in three dimensions, electronic components3D PLUS·Filed 2000·Granted Oct 26, 2004·28 cites·6 claims
- 1379US5400218ADevice for the 3D encapsulation of semiconductor chipsTHOMSON CSF·Filed 1993·Granted Mar 21, 1995·61 cites·18 claims
- 1476US4553020AElectronic component package comprising a moisture-retention elementINF MILIT SPATIALE AERONAUT·Filed 1983·Granted Nov 12, 1985·36 cites·12 claims
- 1575US8735220B2Method for positioning chips during the production of a reconstituted waferVAL CHRISTIAN·Filed 2010·Granted May 27, 2014·4 cites·8 claims
- 1675US8546190B2Method for positioning chips during the production of a reconstituted waferVAL CHRISTIAN·Filed 2010·Granted Oct 1, 2013·4 cites·13 claims
- 1775US4755910AHousing for encapsulating an electronic circuitCIMSA SINTRA·Filed 1986·Granted Jul 5, 1988·44 cites·10 claims
- 1874US4639826ARadiation-hardened casing for an electronic componentINF MILIT SPATIALE AERONAUT·Filed 1984·Granted Jan 27, 1987·47 cites·20 claims
- 1973US10332863B2Method of miniaturized chip on chip interconnection of a 3D electronic module3D PLUS·Filed 2017·Granted Jun 25, 2019·2 cites·12 claims
- 2073US5847448AMethod and device for interconnecting integrated circuits in three dimensionsTHOMSON CSF·Filed 1996·Granted Dec 8, 1998·43 cites·13 claims
- 2173US5002895AWire bonding method with a frame, for connecting an electronic component for testing and mountingTHOMSON CSF·Filed 1989·Granted Mar 26, 1991·41 cites·3 claims
- 2272US4546028AComposite substrate with high heat conductionINF MILIT SPATIALE AERONAUT·Filed 1983·Granted Oct 8, 1985·31 cites·11 claims
- 2371US5885850AMethod for the 3D interconnection of packages of electronic components, and device obtained by this methodTHOMSON CSF·Filed 1993·Granted Mar 23, 1999·45 cites·6 claims
- 2471US5323533AMethod of producing coaxial connections for an electronic component, and component packageTHOMSON CSF·Filed 1992·Granted Jun 28, 1994·44 cites·10 claims
- 2569US4408256AMicrobox for electronic circuit and hybrid circuit having such a microboxTHOMSON CSF·Filed 1982·Granted Oct 4, 1983·29 cites·5 claims
- 2668US8136237B2Method of interconnecting electronic wafersVAL CHRISTIAN·Filed 2008·Granted Mar 20, 2012·4 cites·10 claims
- 2768US5640760AMethod for the 3D interconnection of packages of electronic components using printed circuit boardsTHOMSON CSF·Filed 1995·Granted Jun 24, 1997·39 cites·13 claims
- 2867US9899250B2Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz3D PLUS·Filed 2017·Granted Feb 20, 2018·1 cites·7 claims
- 2967US6307261B1Method for the manufacturing of a semiconductor device which comprises at least one chip and corresponding deviceTHOMSON CSF·Filed 1993·Granted Oct 23, 2001·44 cites·15 claims
- 3061US9111688B2Method for producing reconstituted wafers with support of the chips during their encapsulationVAL CHRISTIAN·Filed 2012·Granted Aug 18, 2015·1 cites·4 claims
- 3161US8243468B2Low-thickness electronic module comprising a stack of electronic packages provided with connection ballsVAL CHRISTIAN·Filed 2006·Granted Aug 14, 2012·2 cites·10 claims
- 3261US5526230A3D interconnection process for electronic component packages and resulting 3D componentsTHOMSON CSF·Filed 1993·Granted Jun 11, 1996·28 cites·11 claims
- 3360US8359740B2Process for the wafer-scale fabrication of electronic modules for surface mounting3D PLUS·Filed 2009·Granted Jan 29, 2013·2 cites·7 claims
- 3457US7635639B2Method for the interconnection of active and passive components and resulting thin heterogeneous component3D PLUS·Filed 2004·Granted Dec 22, 2009·9 cites·9 claims
- 3556US4518818AEncapsulating case able to resist high external pressuresTHOMSON CSF·Filed 1984·Granted May 21, 1985·23 cites·7 claims
- 3655US11587911B2Process for producing a high-frequency-compatible electronic module3D PLUS·Filed 2021·Granted Feb 21, 2023·0 cites·7 claims
- 3752US4216444AStep adjustable attenuatorTHOMSON CSF·Filed 1978·Granted Aug 5, 1980·13 cites·11 claims
- 3844US8716036B2Method for collective fabrication of 3D electronic modules comprising only validated PCBs3D PLUS·Filed 2012·Granted May 6, 2014·0 cites·6 claims
- 3943US10064278B23D electronic module comprising a ball grid array stack3D PLUS·Filed 2016·Granted Aug 28, 2018·0 cites·9 claims
- 4042US2021040620A1Process for metallizing holes of an electronic module by liquid-phase deposition3D PLUS·Filed 2019·Application pending·0 cites
- 4141US8264853B23D electronic moduleVAL CHRISTIAN·Filed 2006·Granted Sep 11, 2012·0 cites·26 claims
- 4239US2005012188A1Device for the hermetic encapsulation of a component that must be protected against all stressesFiled 2002·Application pending·0 cites
- 4337US4517356AProcess for polymerizing thermosetting resinsLAMBERT FRANCOIS·Filed 1983·Granted May 14, 1985·5 cites·3 claims
- 4436US2003173673A1Method for distributed shielding and/or bypass for electronic device with three dimensional interconnectionFiled 2001·Application pending·0 cites
- 4536US2018061731A1Electronic chip device with improved thermal resistance and associated manufacturing process3D PLUS·Filed 2016·Application pending·0 cites
- 4635US10483180B2Process for the wafer-scale fabrication of hermetic electronic modulesPACKAGING SIP·Filed 2017·Granted Nov 19, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →