Inventor · disambiguated record
Chin-Sheng Wang
Also filed as: WANG CHIN S · WANG CHIN SHING · WANG CHIN-SHENG
27 granted patents·27 pending applications·121 citations·filing 2003–2025
94Inventor score
Files withUNIMICRON TECHNOLOGY CORP30WANG CHIN-SHENG7SUBTRON TECHNOLOGY CO LTD6HU LI-MING2TAER INNOVATION CO LTD2
Top patents by PatentIndex Score
54 records- 0196US11690173B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jun 27, 2023·4 cites·8 claims
- 0295US8634887B2Protective frame for mobile communication deviceHU LI-MING·Filed 2012·Granted Jan 21, 2014·41 cites·5 claims
- 0390US8859908B2Package carrierWANG CHIN-SHENG·Filed 2013·Granted Oct 14, 2014·14 cites·12 claims
- 0485US11943877B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 26, 2024·1 cites·6 claims
- 0584USD722952SDetachable smartphone protective device with backup power unitTAER INNOVATION CO LTD·Filed 2013·Granted Feb 24, 2015·35 cites·1 claims
- 0678US8390013B2Semiconductor package structure and fabricating method of semiconductor package structureTSENG TZYY-JANG·Filed 2010·Granted Mar 5, 2013·5 cites·5 claims
- 0777US9870931B2Package carrier and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2016·Granted Jan 16, 2018·2 cites·12 claims
- 0875US2025393127A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0973US9591753B2Circuit board and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted Mar 7, 2017·3 cites·10 claims
- 1072US2025351272A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1170US9008736B2Protective frame for mobile communication deviceTAER INNOVATION CO LTD·Filed 2013·Granted Apr 14, 2015·2 cites·6 claims
- 1269US2025240887A1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1368US12504591B2Co-packaged structure for optics and electricsUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Dec 23, 2025·0 cites·13 claims
- 1464USD712385SMobile phone protecting caseHU LI-MING·Filed 2012·Granted Sep 2, 2014·13 cites·1 claims
- 1564US2024159473A1Vapor chamber structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1663US10177067B2Manufacturing method of package carrierSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted Jan 8, 2019·1 cites·13 claims
- 1763US2025240889A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1862US11445596B2Circuit board having heat-dissipation block and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Sep 13, 2022·0 cites·9 claims
- 1961US2025239511A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2061US2025149426A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2161US2025096145A1Electronic packaging structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2260US2025239558A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2358US12469769B2Electronic packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Nov 11, 2025·0 cites·18 claims
- 2458US2025349681A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 2557US12506056B2Electronic package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 23, 2025·0 cites·19 claims
- 2657US12347912B2Multi-layered resonator circuit structure and multi-layered filter circuit structureUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Jul 1, 2025·0 cites·11 claims
- 2756US2025331108A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2855US2025203776A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2955US2024414850A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3054US12200861B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jan 14, 2025·0 cites·7 claims
- 3153US10714448B2Chip module with porous bonding layer and stacked structure with porous bonding layerUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jul 14, 2020·0 cites·16 claims
- 3253US2023335506A1Electronic packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 3353US2024251504A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 3452US2012175044A1Manufacturing method of thermal conductivity substrateWANG CHIN-SHENG·Filed 2012·Application pending·0 cites
- 3552US2023335419A1Etching device and etching methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3651US10319610B2Package carrierSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted Jun 11, 2019·0 cites·9 claims
- 3751US2023417836A1Detection system for estimating state of battery device and operating method thereofAMIDAS ENERGY CO LTD·Filed 2022·Application pending·0 cites
- 3850US11715715B2Metal bump structure and manufacturing method thereof and driving substrateUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 1, 2023·0 cites·14 claims
- 3950US9282643B2Core substrate and method for fabricating circuit boardWANG CHIN-SHENG·Filed 2014·Granted Mar 8, 2016·0 cites·6 claims
- 4050US2012070684A1Thermal conductivity substrate and manufacturing method thereofWANG CHIN-SHENG·Filed 2011·Application pending·0 cites
- 4149US9204546B2Circuit board and manufacturing method thereofWANG CHIN-SHENG·Filed 2014·Granted Dec 1, 2015·0 cites·17 claims
- 4247US8563363B2Fabricating method of semiconductor package structureTSENG TZYY-JANG·Filed 2012·Granted Oct 22, 2013·0 cites·14 claims
- 4347US2023093870A1Method for Forming Resistance on Circuit Board and Circuit Board Having ResistanceUNIMICRON TECH CORPORATION·Filed 2021·Application pending·0 cites
- 4446US2015114698A1Substrate structure and manufacturing method thereofHUANG TZU-WEI·Filed 2013·Application pending·0 cites
- 4545US11373927B2Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through holeUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 28, 2022·0 cites·20 claims
- 4643US2004264720A1Wireless earphone having replaceable battery moduleFiled 2003·Application pending·0 cites
- 4742US10515870B1Package carrier having a mesh gas-permeable structure disposed in the through holeUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Dec 24, 2019·0 cites·10 claims
- 4842US9433099B2Package carrierWANG CHIN-SHENG·Filed 2013·Granted Aug 30, 2016·0 cites·9 claims
- 4942US2019296102A1Embedded component structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Application pending·0 cites
- 5040US2020214120A1Circuit board having heat-dissipation block and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →