Inventor · disambiguated record
Chih-Yao Wang
Also filed as: WANG CHIH-YAO
8 granted patents·3 pending applications·213 citations·filing 1994–2024
85Inventor score
Top patents by PatentIndex Score
11 records- 0195US11942396B2Heterogeneous integration semiconductor package structureIND TECH RES INST·Filed 2021·Granted Mar 26, 2024·4 cites·16 claims
- 0288US5465782AHigh-efficiency isothermal heat pipeIND TECH RES INST·Filed 1994·Granted Nov 14, 1995·113 cites·4 claims
- 0385US6663278B1Method for determining the thermal performance of a heat sinkIND TECHNOLOGIES RES INST·Filed 2002·Granted Dec 16, 2003·45 cites·20 claims
- 0481US5931156AIntegral heat-pipe type solar collectorIND TECH RES INST·Filed 1997·Granted Aug 3, 1999·48 cites·16 claims
- 0572US10340282B1Semiconductor memory device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 2, 2019·2 cites·20 claims
- 0669US10833091B2Ferroelectric memoriesIND TECH RES INST·Filed 2019·Granted Nov 10, 2020·1 cites·16 claims
- 0766US12352501B1Radiators and immersion tanks using the sameIND TECH RES INST·Filed 2023·Granted Jul 8, 2025·0 cites·32 claims
- 0859US2024365517A1Data center and phase change coolant distribution unit thereofIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0950US11217661B2Ferroelectric memoriesIND TECH RES INST·Filed 2020·Granted Jan 4, 2022·0 cites·20 claims
- 1043US2007163756A1Closed-loop latent heat cooling method and capillary force or non-nozzle module thereofIND TECH RES INST·Filed 2006·Application pending·0 cites
- 1134US2005207120A1Thermal module with heat reservoir and method of applying the same on electronic productsIND TECH RES INST·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →