Inventor · disambiguated record
Chia-Chung Wang
Also filed as: WANG CHIA-CHUNG
104 granted patents·64 pending applications·1,045 citations·filing 1995–2024
99Inventor score
Files withBRIDGE SEMICONDUCTOR CORP111LIN CHARLES W C50IND TECH RES INST3PANACCIONE PAUL1SHELL OIL CO1
Top patents by PatentIndex Score
168 records- 0198US8525214B2Semiconductor chip assembly with post/base heat spreader with thermal viaLIN CHARLES W C·Filed 2011·Granted Sep 3, 2013·56 cites·36 claims
- 0297US7446419B1Semiconductor chip assembly with welded metal pillar of stacked metal ballsBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Nov 4, 2008·59 cites·150 claims
- 0396US6590282B1Stacked semiconductor package formed on a substrate and method for fabricationIND TECH RES INST·Filed 2002·Granted Jul 8, 2003·145 cites·11 claims
- 0495US10134711B2Thermally enhanced semiconductor assembly with three dimensional integration and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2017·Granted Nov 20, 2018·12 cites·7 claims
- 0594US10804205B1Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the sameBRIDGE SEMICONDUCTOR CORP·Filed 2019·Granted Oct 13, 2020·10 cites·21 claims
- 0694US8865525B2Method of making cavity substrate with built-in stiffener and cavity substrate manufactured therebyLIN CHARLES W C·Filed 2012·Granted Oct 21, 2014·19 cites·20 claims
- 0794US8129742B2Semiconductor chip assembly with post/base heat spreader and plated through-holeLIN CHARLES W C·Filed 2011·Granted Mar 6, 2012·15 cites·60 claims
- 0894US7948076B2Semiconductor chip assembly with post/base heat spreader and vertical signal routingBRIDGE SEMICONDUCTOR CORP·Filed 2009·Granted May 24, 2011·26 cites·35 claims
- 0992US10420204B2Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2015·Granted Sep 17, 2019·10 cites·2 claims
- 1092US9318411B2Semiconductor package with package-on-package stacking capability and method of manufacturing the sameBRIDGE SEMICONDUCTOR CORP·Filed 2014·Granted Apr 19, 2016·12 cites·9 claims
- 1192US8304292B1Method of making a semiconductor chip assembly with a ceramic/metal substrateLIN CHARLES W C·Filed 2010·Granted Nov 6, 2012·13 cites·20 claims
- 1292US8076182B2Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the postLIN CHARLES W C·Filed 2010·Granted Dec 13, 2011·14 cites·35 claims
- 1392US7901993B2Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive traceBRIDGE SEMICONDUCTOR CORP·Filed 2010·Granted Mar 8, 2011·11 cites·35 claims
- 1492US7319265B1Semiconductor chip assembly with precision-formed metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Jan 15, 2008·27 cites·40 claims
- 1591US10242964B1Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the sameBRIDGE SEMICONDUCTOR CORP·Filed 2018·Granted Mar 26, 2019·7 cites·17 claims
- 1691US8952526B2Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitryLIN CHARLES W C·Filed 2011·Granted Feb 10, 2015·9 cites·50 claims
- 1791US7494843B1Method of making a semiconductor chip assembly with thermal conductor and encapsulant grindingBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Feb 24, 2009·23 cites·100 claims
- 1890US8343808B2Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitryBRIDGE SEMICONDUCTOR CORP·Filed 2011·Granted Jan 1, 2013·12 cites·37 claims
- 1990US8003415B2Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routingBRIDGE SEMICONDUCTOR CORP·Filed 2009·Granted Aug 23, 2011·18 cites·25 claims
- 2089US10269722B2Wiring board having component integrated with leadframe and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2018·Granted Apr 23, 2019·5 cites·12 claims
- 2189US10211067B1Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assemblyBRIDGE SEMICONDUCTOR CORP·Filed 2018·Granted Feb 19, 2019·6 cites·18 claims
- 2289US10199321B2Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the sameBRIDGE SEMICONDUCTOR CORP·Filed 2017·Granted Feb 5, 2019·6 cites·3 claims
- 2389US9349711B2Semiconductor device with face-to-face chips on interposer and method of manufacturing the sameBRIDGE SEMICONDUCTOR CORP·Filed 2015·Granted May 24, 2016·6 cites·14 claims
- 2489US9209154B2Semiconductor package with package-on-package stacking capability and method of manufacturing the sameBRIDGE SEMICONDUCTOR CORP·Filed 2014·Granted Dec 8, 2015·10 cites·12 claims
- 2589US8531024B2Semiconductor chip assembly with post/base heat spreader and multilevel conductive traceLIN CHARLES W C·Filed 2011·Granted Sep 10, 2013·9 cites·35 claims
- 2689US8324653B1Semiconductor chip assembly with ceramic/metal substrateLIN CHARLES W C·Filed 2010·Granted Dec 4, 2012·9 cites·20 claims
- 2789US8324723B2Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bumpLIN CHARLES W C·Filed 2010·Granted Dec 4, 2012·9 cites·65 claims
- 2889US8212279B2Semiconductor chip assembly with post/base heat spreader, signal post and cavityLIN CHARLES W C·Filed 2010·Granted Jul 3, 2012·10 cites·35 claims
- 2989US7075186B1Semiconductor chip assembly with interlocked contact terminalBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Jul 11, 2006·17 cites·60 claims
- 3087US8927339B2Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitryLIN CHARLES W C·Filed 2011·Granted Jan 6, 2015·9 cites·35 claims
- 3187US8236619B2Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive traceLIN CHARLES W C·Filed 2011·Granted Aug 7, 2012·8 cites·35 claims
- 3287US8236618B2Method of making a semiconductor chip assembly with a post/base/post heat spreaderLIN CHARLES W C·Filed 2011·Granted Aug 7, 2012·8 cites·50 claims
- 3387US8232576B1Semiconductor chip assembly with post/base heat spreader and ceramic block in postLIN CHARLES W C·Filed 2010·Granted Jul 31, 2012·10 cites·20 claims
- 3487US6876072B1Semiconductor chip assembly with chip in substrate cavityBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Apr 5, 2005·47 cites·200 claims
- 3586US10354984B2Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2016·Granted Jul 16, 2019·5 cites·11 claims
- 3686US8535985B2Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bumpLIN CHARLES W C·Filed 2011·Granted Sep 17, 2013·7 cites·32 claims
- 3786US7939375B2Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the postBRIDGE SEMICONDUCTOR CORP·Filed 2010·Granted May 10, 2011·8 cites·35 claims
- 3886US7656031B2Stackable semiconductor package having metal pin within through hole of packageBRIDGE SEMICONDUCTOR CORP·Filed 2007·Granted Feb 2, 2010·19 cites·7 claims
- 3986US7419851B2Method of making a semiconductor chip assembly with a metal containment wall and a solder terminalBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Sep 2, 2008·13 cites·200 claims
- 4086US7414319B2Semiconductor chip assembly with metal containment wall and solder terminalBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Aug 19, 2008·13 cites·100 claims
- 4186US7232707B1Method of making a semiconductor chip assembly with an interlocked contact terminalBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Jun 19, 2007·13 cites·140 claims
- 4286US7232706B1Method of making a semiconductor chip assembly with a precision-formed metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Jun 19, 2007·11 cites·100 claims
- 4385US10177090B2Package-on-package semiconductor assembly having bottom device confined by dielectric recessBRIDGE SEMICONDUCTOR CORP·Filed 2016·Granted Jan 8, 2019·5 cites·7 claims
- 4485US9947625B2Wiring board with embedded component and integrated stiffener and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2016·Granted Apr 17, 2018·4 cites·13 claims
- 4585US8310043B2Semiconductor chip assembly with post/base heat spreader with ESD protection layerLIN CHARLES W C·Filed 2010·Granted Nov 13, 2012·8 cites·55 claims
- 4685US8193556B2Semiconductor chip assembly with post/base heat spreader and cavity in postLIN CHARLES W C·Filed 2010·Granted Jun 5, 2012·7 cites·45 claims
- 4785US8178395B2Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal viaLIN CHARLES W C·Filed 2011·Granted May 15, 2012·7 cites·40 claims
- 4885US7811863B1Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachmentBRIDGE SEMICONDUCTOR CORP·Filed 2009·Granted Oct 12, 2010·14 cites·100 claims
- 4984US8062912B2Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routingWANG CHIA-CHUNG·Filed 2009·Granted Nov 22, 2011·14 cites·25 claims
- 5084US8034645B2Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreaderBRIDGE SEMICONDUCTOR CORP·Filed 2009·Granted Oct 11, 2011·10 cites·60 claims
Showing the top 50 of 168 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →