Inventor · disambiguated record
Chen-Hsiao Wang
Also filed as: WANG CHEN-HSIAO
6 granted patents·9 pending applications·4 citations·filing 2015–2025
70Inventor score
Files withUNITED MICROELECTRONICS CORP15
Top patents by PatentIndex Score
15 records- 0178US2025218995A1Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0278US2025218994A1Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0378US2025218997A1Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0478US2025218996A1Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0576US12482777B2Copper pillar bump structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 25, 2025·0 cites·6 claims
- 0671US2024063774A1Surface acoustic wave deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0770US9502366B2Semiconductor structure with UBM layer and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·3 cites·11 claims
- 0870US2024170332A1Wafer with test structure and method of dicing waferUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0964US11848660B2Surface acoustic wave device fabrication methodUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 19, 2023·0 cites·9 claims
- 1062US10340230B1Semiconductor chipUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 2, 2019·1 cites·20 claims
- 1159US2024413136A1Three-dimensional integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1259US2023018710A1Wafer with test structure and method of dicing waferUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 1356US2025157868A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1453US12387998B2QFN package and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 1544US11495510B2Semiconductor device package structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Chen-Hsiao Wang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →