Inventor · disambiguated record
Chen Wang
Also filed as: WANG CHEN · WANG CHEN KUN
4 granted patents·3 pending applications·44 citations·filing 2008–2023
68Inventor score
Files withRICHARDSON THOMAS B2ACM RESEARCH SHANGHAI INC1ENTHONE1MACDERMID ENTHONE INC1PROSEMI CO LTD1
Top patents by PatentIndex Score
7 records- 0194US7670950B2Copper metallization of through silicon viaENTHONE·Filed 2008·Granted Mar 2, 2010·43 cites·21 claims
- 0263US10103029B2Process for filling vias in the microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted Oct 16, 2018·1 cites·27 claims
- 0351US2024376627A1Electroplating apparatusACM RESEARCH SHANGHAI INC·Filed 2022·Application pending·0 cites
- 0448US2024118628A1Semiconductor pattern for a patterning process, and method and system for overlay control using the semiconductor patternPROSEMI CO LTD·Filed 2023·Application pending·0 cites
- 0540US10541140B2Process for filling vias in the microelectronicsRICHARDSON THOMAS B·Filed 2012·Granted Jan 21, 2020·0 cites·24 claims
- 0640US2009311865A1Method for double patterning lithographyWANG CHEN KUN·Filed 2009·Application pending·0 cites
- 0733US10221496B2Copper filling of through silicon viasRICHARDSON THOMAS B·Filed 2011·Granted Mar 5, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →