Inventor · disambiguated record
Chien Kai Wei
Also filed as: WEI CHIEN-KAI
4 granted patents·8 pending applications·0 citations·filing 2021–2022
53Inventor score
Top patents by PatentIndex Score
12 records- 0177US12378407B2Resin compositionNAN YA PLASTICS CORP·Filed 2022·Granted Aug 5, 2025·0 cites·8 claims
- 0273US12077667B2Resin compositionNAN YA PLASTICS CORP·Filed 2022·Granted Sep 3, 2024·0 cites·9 claims
- 0371US11859083B2Low-dielectric rubber resin material and low-dielectric metal substrateNAN YA PLASTICS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·10 claims
- 0468US11920036B2Rubber resin material with high dielectric constantNAN YA PLASTICS CORP·Filed 2022·Granted Mar 5, 2024·0 cites·9 claims
- 0568US2023089728A1Polyphenylene ether resin modified with benzoxazine, method for producing the same, and substrate material for circuit boardNAN YA PLASTICS CORP·Filed 2022·Application pending·0 cites
- 0667US2023091594A1Polyphenylene ether resin modified with bismaleimide, method for producing the same, and substrate material for circuit boardNAN YA PLASTICS CORP·Filed 2022·Application pending·0 cites
- 0766US2023090736A1Polyphenylene ether resin modified with two amino functional groups, method for producing the same, and substrate material for circuit boardNAN YA PLASTICS CORP·Filed 2022·Application pending·0 cites
- 0865US2023128476A1Resin material and metal substrateNAN YA PLASTICS CORP·Filed 2022·Application pending·0 cites
- 0965US2023167300A1Resin compositionNAN YA PLASTICS CORP·Filed 2022·Application pending·0 cites
- 1064US2023279226A1Polyimide resinNAN YA PLASTICS CORP·Filed 2022·Application pending·0 cites
- 1160US2023072223A1Resin compositionNAN YA PLASTICS CORP·Filed 2021·Application pending·0 cites
- 1256US2023002611A1Thermosetting resin material, prepreg, and metal substrateNANYA PLASTICS CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →