Rubber resin material with high dielectric constant

Abstract

A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

What is claimed is: 
     
       1. A rubber resin material with high dielectric constant, comprising:
 a rubber resin composition with high dielectric constant, and 
 inorganic fillers,
 wherein the rubber resin composition with high dielectric constant includes:
 40 wt % to 70 wt % of a liquid rubber, wherein a molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol, and monomers forming the liquid rubber include a styrene monomer and a butadiene monomer; 
 10 wt % to 30 wt % of a polyphenylene ether resin; and 
 20 wt % to 40 wt % of a crosslinker; 
 
 wherein, based on a total weight of the rubber resin composition with high dielectric constant being 100 phr, the inorganic fillers consist of:
 100 phr to 190 phr of at least one inorganic compound selected from the group consisting of titanium dioxide, strontium titanate, and calcium titanate, 
 10 phr to 30 phr of alumina, and 
 20 phr to 60 phr of silicon dioxide; 
 
 wherein a dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0. 
 
 
     
     
       2. The rubber resin material with high dielectric constant according to  claim 1 , wherein, based on a total amount of the liquid rubber being 100 mol %, an amount of the styrene monomer ranges from 10 mol % to 50 mol %. 
     
     
       3. The rubber resin material with high dielectric constant according to  claim 1 , wherein, based on a total amount of the butadiene monomer being 100 mol %, 30 mol % to 90 mol % of the butadiene monomer has a side chain containing an ethylene group after polymerization. 
     
     
       4. The rubber resin material with high dielectric constant according to  claim 1 , wherein the inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group. 
     
     
       5. The rubber resin material with high dielectric constant according to  claim 1 , further comprising a siloxane coupling agent, wherein the siloxane coupling agent has at least one of an acrylic group and an ethylene group. 
     
     
       6. The rubber resin material with high dielectric constant according to  claim 5 , wherein, based on a total weight of the rubber resin composition with high dielectric constant being 100 phr, an amount of the siloxane coupling agent ranges from 0.1 phr to 5 phr. 
     
     
       7. A metal substrate with high dielectric constant, comprising a substrate layer and a metal layer disposed on the substrate layer, wherein the substrate layer is formed from a rubber resin material with high dielectric constant, the rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers, and the rubber resin composition with high dielectric constant includes:
 40 wt % to 70 wt % of a liquid rubber, wherein a molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol, and monomers forming the liquid rubber include a styrene monomer and a butadiene monomer; 
 10 wt % to 30 wt % of a polyphenylene ether resin; and 
 20 wt % to 40 wt % of a crosslinker; 
 wherein, based on a total weight of the rubber resin composition with high dielectric constant being 100 phr, the inorganic fillers consist of: 
 100 phr to 190 phr inorganic compound selected from the group consisting of titanium dioxide, strontium titanate, and calcium titanate, 
 10 phr to 30 phr of alumina, and 
 20 phr to 60 phr of silicon dioxide; 
 wherein a dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0. 
 
     
     
       8. The metal substrate with high dielectric constant according to  claim 7 , wherein the metal substrate with high dielectric constant has a dielectric constant higher than or equal to 5.0. 
     
     
       9. The metal substrate with high dielectric constant according to  claim 7 , wherein a peeling strength of the metal substrate with high dielectric constant ranges from 4.5 lb/in to 7.0 lb/in.