Inventor · disambiguated record
Ching-Yang Wen
Also filed as: WEN CHING-YANG
17 granted patents·8 pending applications·10 citations·filing 2007–2025
88Inventor score
Files withUNITED MICROELECTRONICS CORP25
Top patents by PatentIndex Score
25 records- 0190US11476363B2Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 18, 2022·2 cites·12 claims
- 0289US12191195B2Method of fabricating an air gapUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 7, 2025·2 cites·18 claims
- 0387US11670567B2Semiconductor structure and method of wafer bondingUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jun 6, 2023·2 cites·20 claims
- 0483US10923599B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 16, 2021·3 cites·20 claims
- 0573US12080622B2Semiconductor structure and method of wafer bondingUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0673US11881529B2Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jan 23, 2024·0 cites·8 claims
- 0770US2025349599A1Method of forming protective layer utilized in silicon remove processUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0870US2024170490A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0968US11955292B2Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 9, 2024·0 cites·7 claims
- 1067US12300534B2Method of forming protective layer utilized in silicon remove processUNITED MICROELECTRONICS CORP·Filed 2022·Granted May 13, 2025·0 cites·10 claims
- 1166US10763170B2Semiconductor device including buried insulation layer and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 1, 2020·1 cites·17 claims
- 1263US11715709B2Manufacturing method of radiofrequency device including mold compound layerUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 1, 2023·0 cites·7 claims
- 1362US11923373B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 5, 2024·0 cites·18 claims
- 1460US11398548B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 26, 2022·0 cites·8 claims
- 1559US2025194244A1Three dimensional structrue with fd-soi transistorUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1658US11929213B2Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Mar 12, 2024·0 cites·9 claims
- 1758US2025183096A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1856US11296023B2Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 5, 2022·0 cites·20 claims
- 1955US12324168B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 3, 2025·0 cites·11 claims
- 2054US2024178137A1Method for determining antenna rule for radio-frequency deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2151US2025241057A1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2250US11362048B2Radiofrequency device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 14, 2022·0 cites·6 claims
- 2350US10903314B2Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 26, 2021·0 cites·12 claims
- 2439US2008200039A1Nitridation processUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2529US2019051666A1Semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →