Inventor · disambiguated record
Chaofu Weng
Also filed as: WENG CHAOFU
1 granted patent·2 pending applications·38 citations·filing 2009–2012
48Inventor score
Top patents by PatentIndex Score
3 records- 0187US8110916B2Chip package structure and manufacturing methods thereofWENG CHAOFU·Filed 2009·Granted Feb 7, 2012·38 cites·20 claims
- 0246US2012104634A1Chip package structure and manufacturing methods thereofWENG CHAOFU·Filed 2012·Application pending·0 cites
- 0335US2011127654A1Semiconductor Package and Manufacturing Methods ThereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →