Inventor · disambiguated record
Chun Hong Wo
Also filed as: WO CHUN HONG
5 granted patents·2 pending applications·14 citations·filing 2013–2019
75Inventor score
Files withUTAC HEADQUARTERS PTE LTD4UNITED TEST & ASSEMBLY CT LT2UNITED TEST AND ASSEMBLY CENTER LTD1
Top patents by PatentIndex Score
7 records- 0180US9786625B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
- 0280US9165878B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Oct 20, 2015·6 cites·25 claims
- 0376US9087777B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Jul 21, 2015·3 cites·22 claims
- 0467US9960130B2Reliable interconnectUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2015·Granted May 1, 2018·2 cites·22 claims
- 0558US2019348387A1Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2019·Application pending·0 cites
- 0655US10403592B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
- 0745US2016043041A1Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →