Inventor · disambiguated record
Charles G. Woychik
Also filed as: WOYCHIK CHARLES G · WOYCHIK CHARLES GERARD
124 granted patents·12 pending applications·3,565 citations·filing 1989–2019
99Inventor score
Top patents by PatentIndex Score
136 records- 0199US10446456B2Integrated circuits protected by substrates with cavities, and methods of manufactureINVENSAS CORP·Filed 2018·Granted Oct 15, 2019·172 cites·8 claims
- 0298US9824974B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·54 cites·20 claims
- 0398US9502390B2BVA interposerINVENSAS CORP·Filed 2013·Granted Nov 22, 2016·59 cites·27 claims
- 0498US9478504B1Microelectronic assemblies with cavities, and methods of fabricationINVENSAS CORP·Filed 2015·Granted Oct 25, 2016·64 cites·10 claims
- 0598US9397038B1Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2015·Granted Jul 19, 2016·27 cites·25 claims
- 0698US9355997B2Integrated circuit assemblies with reinforcement frames, and methods of manufactureINVENSAS CORP·Filed 2014·Granted May 31, 2016·53 cites·22 claims
- 0798US9252127B1Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufactureINVENSAS CORP·Filed 2014·Granted Feb 2, 2016·53 cites·14 claims
- 0898US7892176B2Monitoring or imaging system with interconnect structure for large area sensor arrayGEN ELECTRIC·Filed 2007·Granted Feb 22, 2011·79 cites·24 claims
- 0998US6236115B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted May 22, 2001·342 cites·3 claims
- 1098US6187678B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted Feb 13, 2001·274 cites·16 claims
- 1198US6002177AHigh density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1995·Granted Dec 14, 1999·408 cites·20 claims
- 1297US9735084B2Bond via array for thermal conductivityINVENSAS CORP·Filed 2014·Granted Aug 15, 2017·38 cites·20 claims
- 1397US9349669B2Reduced stress TSV and interposer structuresINVENSAS CORP·Filed 2015·Granted May 24, 2016·23 cites·25 claims
- 1497US9000600B2Reduced stress TSV and interposer structuresINVENSAS CORP·Filed 2014·Granted Apr 7, 2015·28 cites·15 claims
- 1597US6399892B1CTE compensated chip interposerIBM·Filed 2000·Granted Jun 4, 2002·91 cites·20 claims
- 1696US7451651B2Modular sensor assembly and methods of fabricating the sameGEN ELECTRIC·Filed 2006·Granted Nov 18, 2008·70 cites·22 claims
- 1795US9780042B2Tunable composite interposerINVENSAS CORP·Filed 2016·Granted Oct 3, 2017·11 cites·20 claims
- 1895US8345508B2Large area modular sensor array assembly and method for making the sameGEN ELECTRIC·Filed 2010·Granted Jan 1, 2013·86 cites·20 claims
- 1994US6559666B2Method and device for semiconductor testing using electrically conductive adhesivesIBM·Filed 2001·Granted May 6, 2003·80 cites·16 claims
- 2094US5038996ABonding of metallic surfacesIBM·Filed 1989·Granted Aug 13, 1991·80 cites·15 claims
- 2193US11205600B2Integrated circuits protected by substrates with cavities, and methods of manufactureINVENSAS CORP·Filed 2019·Granted Dec 21, 2021·9 cites·22 claims
- 2293US9953957B2Embedded graphite heat spreader for 3DICINVENSAS CORP·Filed 2015·Granted Apr 24, 2018·10 cites·19 claims
- 2393US9548273B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2015·Granted Jan 17, 2017·10 cites·20 claims
- 2493US8884427B2Low CTE interposer without TSV structureINVENSAS CORP·Filed 2013·Granted Nov 11, 2014·13 cites·19 claims
- 2593US5159535AMethod and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrateIBM·Filed 1989·Granted Oct 27, 1992·145 cites·12 claims
- 2692US10381326B2Structure and method for integrated circuits packaging with increased densityINVENSAS CORP·Filed 2014·Granted Aug 13, 2019·19 cites·5 claims
- 2792US8963335B2Tunable composite interposerWOYCHIK CHARLES G·Filed 2012·Granted Feb 24, 2015·13 cites·29 claims
- 2892US6516513B2Method of making a CTE compensated chip interposerIBM·Filed 2002·Granted Feb 11, 2003·41 cites·13 claims
- 2991US9991231B2Stacked die integrated circuitINVENSAS CORP·Filed 2016·Granted Jun 5, 2018·7 cites·14 claims
- 3091US9899281B2Integrated circuits protected by substrates with cavities, and methods of manufactureINVENSAS CORP·Filed 2016·Granted Feb 20, 2018·4 cites·17 claims
- 3191US9402312B2Circuit assemblies with multiple interposer substrates, and methods of fabricationINVENSAS CORP·Filed 2014·Granted Jul 26, 2016·11 cites·16 claims
- 3291US8981564B2Metal PVD-free conducting structuresINVENSAS CORP·Filed 2013·Granted Mar 17, 2015·11 cites·22 claims
- 3390US10586785B2Embedded graphite heat spreader for 3DICINVENSAS CORP·Filed 2018·Granted Mar 10, 2020·5 cites·20 claims
- 3490US6774315B1Floating interposerIBM·Filed 2000·Granted Aug 10, 2004·43 cites·9 claims
- 3590US5075965ALow temperature controlled collapse chip attach processIBM·Filed 1990·Granted Dec 31, 1991·166 cites·11 claims
- 3689US10325880B2Hybrid 3D/2.5D interposerINVENSAS CORP·Filed 2018·Granted Jun 18, 2019·5 cites·22 claims
- 3789US10297582B2BVA interposerINVENSAS CORP·Filed 2015·Granted May 21, 2019·6 cites·11 claims
- 3889US5730932ALead-free, tin-based multi-component solder alloysIBM·Filed 1996·Granted Mar 24, 1998·67 cites·17 claims
- 3988US9362204B2Tunable composite interposerINVENSAS CORP·Filed 2015·Granted Jun 7, 2016·5 cites·7 claims
- 4088US8723049B2Low-stress TSV design using conductive particlesWOYCHIK CHARLES G·Filed 2011·Granted May 13, 2014·9 cites·23 claims
- 4188US6130476ASemiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusionIBM·Filed 1995·Granted Oct 10, 2000·85 cites·9 claims
- 4287US10256177B2Integrated interposer solutions for 2D and 3D IC packagingINVENSAS CORP·Filed 2017·Granted Apr 9, 2019·4 cites·20 claims
- 4387US7781238B2Methods of making and using integrated and testable sensor arrayWODNICKI ROBERT GIDEON·Filed 2007·Granted Aug 24, 2010·12 cites·22 claims
- 4487US6667557B2Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connectionsIBM·Filed 2003·Granted Dec 23, 2003·43 cites·16 claims
- 4586US6570259B2Apparatus to reduce thermal fatigue stress on flip chip solder connectionsIBM·Filed 2001·Granted May 27, 2003·43 cites·19 claims
- 4686US6330967B1Process to produce a high temperature interconnectionIBM·Filed 1997·Granted Dec 18, 2001·51 cites·4 claims
- 4785US9673124B2Device and method for localized underfillINVENSAS CORP·Filed 2016·Granted Jun 6, 2017·4 cites·20 claims
- 4885US9536862B2Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufactureINVENSAS CORP·Filed 2015·Granted Jan 3, 2017·4 cites·13 claims
- 4985US9508687B2Low cost hybrid high density packageTESSERA INC·Filed 2015·Granted Nov 29, 2016·4 cites·16 claims
- 5085US8929071B2Low cost manufacturing of micro-channel heatsinkBEAUPRE RICHARD ALFRED·Filed 2008·Granted Jan 6, 2015·13 cites·22 claims
Showing the top 50 of 136 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →