Inventor · disambiguated record
Chieh-Han Wu
Also filed as: WU CHIEH-HAN
17 granted patents·6 pending applications·3,896 citations·filing 2013–2025
93Inventor score
Top patents by PatentIndex Score
23 records- 0199US9576814B2Method of spacer patterning to form a target integrated circuit patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 21, 2017·3.1k cites·20 claims
- 0299US9184054B1Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 10, 2015·786 cites·20 claims
- 0397US12046551B2Interconnect structure having a barrier layer along the sidewall of self-aligned via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·2 cites·20 claims
- 0496US11631639B2Method of fabricating self-aligned via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 18, 2023·2 cites·20 claims
- 0593US9136106B2Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·11 cites·20 claims
- 0692US11676862B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0791US11251118B2Self-aligned via structures with barrier layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 15, 2022·4 cites·20 claims
- 0888US12444676B2Self-aligned via for interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0988US9418886B1Method of forming conductive featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 16, 2016·6 cites·20 claims
- 1087US2025357206A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1186US12165920B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·1 cites·20 claims
- 1284US11830910B2Semiconductor structure having air gaps and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·1 cites·20 claims
- 1380US2025087535A1Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1479US12476142B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1578US2024379437A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1668US2023378255A1Semiconductor structure having air gaps and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1764US9640397B2Method of fabricating a semiconductor integrated circuit using a directed self-assembly block copolymerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 2, 2017·1 cites·19 claims
- 1858US10049919B2Semiconductor device including a target integrated circuit patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·0 cites·20 claims
- 1958US2025105057A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2056US11393718B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·0 cites·20 claims
- 2153US9418862B2Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 16, 2016·0 cites·20 claims
- 2251US2023039661A1Interconnect structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2345US9653349B2Semiconductor integrated circuit with nano gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →