Inventor · disambiguated record
Cheng-Ming Wu
Also filed as: WU CHENG M · WU CHENG-MING
57 granted patents·20 pending applications·1,304 citations·filing 1991–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD39TAIWAN SEMICONDUCTOR MFG26BAO SONG PREC INDUSTRY CO LTD2GOPRO INC2WU CHENG M2
Top patents by PatentIndex Score
77 records- 0195USD788835SCameraGOPRO INC·Filed 2016·Granted Jun 6, 2017·92 cites·1 claims
- 0295USD762759SCameraGOPRO INC·Filed 2014·Granted Aug 2, 2016·102 cites·1 claims
- 0395US6143604AMethod for fabricating small-size two-step contacts for word-line strapping on dynamic random access memory (DRAM)TAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 7, 2000·252 cites·30 claims
- 0491US6042999ARobust dual damascene processTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Mar 28, 2000·120 cites·41 claims
- 0589US12051704B2Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·1 cites·20 claims
- 0689US8820385B2Control device for cordless blind with willful stopWU CHENG-MING·Filed 2012·Granted Sep 2, 2014·22 cites·15 claims
- 0786US2025314777A1Pixel array including time-of-flight sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0886US2025324797A1Semiconductor arrangement with isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0985US12021105B2Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 25, 2024·1 cites·20 claims
- 1085US6436763B1Process for making embedded DRAM circuits having capacitor under bit-line (CUB)TAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Aug 20, 2002·39 cites·20 claims
- 1185US6037213AMethod for making cylinder-shaped capacitors for dynamic random access memoryTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Mar 14, 2000·55 cites·20 claims
- 1284US11309265B2Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·3 cites·20 claims
- 1384US5985765AMethod for reducing bonding pad loss using a capping layer when etching bonding pad passivation openingsTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Nov 16, 1999·78 cites·20 claims
- 1483US12408464B2Semiconductor arrangement with isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 1583US12386073B2Pixel array including time-of-flight sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1683US6307213B1Method for making a fuse structure for improved repaired yields on semiconductor memory devicesTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 23, 2001·31 cites·5 claims
- 1783US6168984B1Reduction of the aspect ratio of deep contact holes for embedded DRAM devicesTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 2, 2001·61 cites·32 claims
- 1883US2025344540A1Semiconductor image sensor and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1982US6165839AProcess to fabricate a cylindrical, capacitor structure under a bit line structure for a dynamic random access memory cellTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Dec 26, 2000·53 cites·13 claims
- 2081US11670651B2Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·1 cites·20 claims
- 2181US6329251B1Microelectronic fabrication method employing self-aligned selectively deposited silicon layerTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Dec 11, 2001·35 cites·15 claims
- 2278US12277795B2Optical fingerprint sensor with enhanced anti-counterfeiting featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 2378US2024386743A1Optical fingerprint sensor with enhanced anti-counterfeiting featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2478US2024332325A1Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2577US12051659B2Semiconductor devices having conductive pad structures with multi-barrier filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 2676US2025318313A1Integration of solar cell and image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2775US11837619B2Semiconductor arrangement with isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 2874US12471408B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 2974US12457812B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 3074US6121073AMethod for making a fuse structure for improved repaired yields on semiconductor memory devicesTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Sep 19, 2000·40 cites·23 claims
- 3174US2023387171A1Deep trench isolation structure in a pixel sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3274US2023387152A1Pixel sensor including a transfer finfetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3373US12396285B2Integration of solar cell and image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 3473US12164034B2Pixel array including time-of-flight sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·16 claims
- 3573US11688703B2Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 27, 2023·0 cites·20 claims
- 3673US2025063837A1Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3773US2023402480A1Method of manufacturing semiconductor image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3872US12166048B2Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 3971US12243894B2Stacked image sensors and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 4071US6168989B1Process for making new and improved crown-shaped capacitors on dynamic random access memory cellsTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 2, 2001·33 cites·25 claims
- 4169US12142630B2Vertically arranged semiconductor pixel sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 4269US6077738AInter-level dielectric planarization approach for a DRAM crown capacitor processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 20, 2000·41 cites·26 claims
- 4369US6033981AKeyhole-free process for high aspect ratio gap filingTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Mar 7, 2000·36 cites·25 claims
- 4468US12446338B2Method for manufacturing image sensor including forming FinFET transfer gate having a plurality of channel fins above a p-type regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·20 claims
- 4567US12255217B2Semiconductor device, semiconductor image sensor, and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 4667US6727029B1Method for making reticles with reduced particle contamination and reticles formedTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 27, 2004·12 cites·18 claims
- 4767US6015734AMethod for improving the yield on dynamic random access memory (DRAM) with cylindrical capacitor structuresTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Jan 18, 2000·23 cites·20 claims
- 4866US2025176300A1Stacked image sensors and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4965US2022344382A1Deep trench isolation structure in a pixel sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 5063US5156165ABirth control and disease preventing deviceWU CHENG M·Filed 1991·Granted Oct 20, 1992·21 cites·7 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →