Inventor · disambiguated record
Chi-Hsi Wu
Also filed as: WU CHI-HSI
181 granted patents·19 pending applications·3,715 citations·filing 1997–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD177TAIWAN SEMICONDUCTOR MFG9WINBOND ELECTRONICS CORP4KAO TA-WEI2LAI KAO-TING1
Top patents by PatentIndex Score
200 records- 0199US11852868B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·7 cites·20 claims
- 0299US11721559B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·4 cites·20 claims
- 0399US11508695B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·7 cites·20 claims
- 0499US11493689B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·18 cites·20 claims
- 0599US11417580B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·9 cites·20 claims
- 0699US10153222B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·79 cites·20 claims
- 0799US10062648B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·70 cites·19 claims
- 0899US9997464B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·64 cites·20 claims
- 0999US9818720B2Structure and formation method for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·53 cites·20 claims
- 1099US9812337B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·66 cites·20 claims
- 1199US9806058B2Chip package having die structures of different heights and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·60 cites·20 claims
- 1299US9768133B1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·45 cites·20 claims
- 1399US9741690B1Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·52 cites·20 claims
- 1498US11728254B2Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·11 cites·20 claims
- 1598US10867965B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·23 cites·20 claims
- 1698US10529690B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·35 cites·20 claims
- 1798US10347606B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·19 cites·20 claims
- 1898US9281254B2Methods of forming integrated circuit packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·1.8k cites·20 claims
- 1997US11961800B2Via for semiconductor device connection and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 2097US11842983B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·3 cites·20 claims
- 2197US11462418B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·5 cites·20 claims
- 2297US11251071B2Raised via for terminal connections on different planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 2397US10867954B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 15, 2020·14 cites·20 claims
- 2497US10811394B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·10 cites·20 claims
- 2597US10720401B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·18 cites·20 claims
- 2697US10461009B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·15 cites·20 claims
- 2797US10319699B2Chip package having die structures of different heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·21 cites·20 claims
- 2896US10866373B2Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·9 cites·20 claims
- 2996US10475768B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 12, 2019·11 cites·20 claims
- 3096US10157852B2Multi-stacked package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·9 cites·20 claims
- 3196US10026704B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 17, 2018·10 cites·20 claims
- 3296US9735082B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·19 claims
- 3396US9583415B2Packages with thermal interface material on the sidewalls of stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 28, 2017·30 cites·19 claims
- 3496US9502343B1Dummy metal with zigzagged edgesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·14 cites·20 claims
- 3596US8697515B2Method of making a FinFET deviceYIN JOANNA CHAW YANE·Filed 2012·Granted Apr 15, 2014·51 cites·20 claims
- 3695US10746923B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·14 cites·20 claims
- 3795US9984998B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·9 cites·20 claims
- 3895US9911672B1Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·22 cites·17 claims
- 3995US9805984B2FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·13 cites·20 claims
- 4095US8729634B2FinFET with high mobility and strain channelSHEN CHUN-LIANG·Filed 2012·Granted May 20, 2014·581 cites·20 claims
- 4194US12327819B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·20 claims
- 4294US11978714B2Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·1 cites·18 claims
- 4394US9659810B2Method of making a FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·14 cites·20 claims
- 4493US11133258B2Package with bridge die for interconnection and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·9 cites·19 claims
- 4593US10770365B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·6 cites·20 claims
- 4693US10636775B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 28, 2020·6 cites·20 claims
- 4793US10269682B2Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·9 cites·21 claims
- 4893US10141288B2Surface mount device/integrated passive device on package or device structure and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 27, 2018·9 cites·20 claims
- 4992US11967546B2Giga interposer integration through Chip-On-Wafer-On-SubstrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 23, 2024·1 cites·20 claims
- 5092US11177238B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·5 cites·20 claims
Showing the top 50 of 200 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →