Inventor · disambiguated record
Chien-Te Wu
Also filed as: WU CHIEN T · WU CHIEN-TE
27 granted patents·18 pending applications·257 citations·filing 1988–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22HOLYGO CORP5SAN FANG CHEMICAL INDUSTRY CO3COMPUTER DESIGN INC2UNIMICRON TECHNOLOGY CORP2
Top patents by PatentIndex Score
45 records- 0195US11609374B2Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 21, 2023·2 cites·20 claims
- 0290US11095272B2Flip-flop cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·6 cites·20 claims
- 0388US5107444AMethod and apparatus for flattening three-dimensional surfacesCOMPUTER DESIGN INC·Filed 1988·Granted Apr 21, 1992·98 cites·23 claims
- 0486US2025347862A1Method of making semiconductor device including optical through via and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0585US12271029B2Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 0685US5448687AComputer-assisted design system for flattening a three-dimensional surface and for wrapping a flat shape to a three-dimensional surfaceCOMPUTER DESIGN INC·Filed 1992·Granted Sep 5, 1995·120 cites·60 claims
- 0784US2025392289A1Flip-flop cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0883US11637547B2Flip-flop cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·1 cites·20 claims
- 0982US10338643B2Magnetic electronic deviceHOLYGO CORP·Filed 2016·Granted Jul 2, 2019·4 cites·20 claims
- 1081US11994713B2Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 1181US2025093765A1Methods for making semiconductor-based integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1281US2025216605A1Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1380US12197123B2Methods for making semiconductor-based integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 1480US12181722B2Structures and process flow for integrated photonic-electric ic package by using polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 1580US2025130379A1Structures and process flow for integrated photonic-electric ic package by using polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1680US2025364358A1Device level thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1778US10909297B1Deterministic system for device layout optimizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 2, 2021·2 cites·20 claims
- 1876US12388426B2Flip-flop cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·19 claims
- 1976US2024345425A1Semiconductor device manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2074US2023384537A1Method of making semiconductor device including optical through via and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2173US9782241B2Orthodontic structure capable of implanting implants and straightening teethCHIEN-TE·Filed 2016·Granted Oct 10, 2017·2 cites·7 claims
- 2272US11754794B2Semiconductor device including optical through via and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 2370US11852967B2Methods for making semiconductor-based integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2470US11740415B2Structures and process flow for integrated photonic-electric IC package by using polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 2566US12055800B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 2664US2023031333A1Device level thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2760US2024125776A1Magnetic microcarriers for image differentiated multiplex assaysPLEXBIO CO LTD·Filed 2023·Application pending·0 cites
- 2855US6429710B1Input buffer with compensation for process variationETRON TECHNOLOGY INC·Filed 1996·Granted Aug 6, 2002·14 cites·17 claims
- 2954US11387035B2Wireless charging coilHOLYGO CORP·Filed 2019·Granted Jul 12, 2022·0 cites·9 claims
- 3053US6912703B2Structure of integrated circuit standard cell library for reducing power supply voltage fluctuationTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 28, 2005·4 cites·27 claims
- 3152US11309122B2Wireless charging coil structure with function of heat dissipationHOLYGO CORP·Filed 2016·Granted Apr 19, 2022·0 cites·9 claims
- 3249US11469042B2Punching process for manufacture of wireless charging coils and manufacture method for wireless charging coilsHOLYGO CORP·Filed 2019·Granted Oct 11, 2022·0 cites·6 claims
- 3347USD881126SCoil for wireless chargerHOLYGO CORP·Filed 2018·Granted Apr 14, 2020·4 cites·1 claims
- 3446US2009279621A1Signal converter and multimedia system using the sameHSIEH SHUI-LAI·Filed 2008·Application pending·0 cites
- 3545US2005244654A1Artificial leatherSAN FANG CHEMICAL INDUSTRY CO·Filed 2004·Application pending·0 cites
- 3644US7187634B2Control circuit for optical record medium processing device and method thereofMICRO STAR INT CO LTD·Filed 2003·Granted Mar 6, 2007·0 cites·9 claims
- 3744US2017325917A1Root assembly with position recognitionTAIWAN SHAN YIN INT CO LTD·Filed 2016·Application pending·0 cites
- 3842US2007141394A1Light-emitting element and iridium complexUNIV TSINGHUA·Filed 2006·Application pending·0 cites
- 3941US8586201B2Light-emitting element and iridium complexCHENG CHIEN-HONG·Filed 2010·Granted Nov 19, 2013·0 cites·20 claims
- 4040US2006147642A1Method for producing artificial leatherSAN FANG CHEMICAL INDUSTRY CO·Filed 2006·Application pending·0 cites
- 4140US2009094394A1Transmission cable capable of transmitting e-sata signals and electricityWU CHIEN-TE·Filed 2008·Application pending·0 cites
- 4239US2012225248A1Artificial leather having composite fiber and method for making the sameWANG LUNG-CHUAN·Filed 2012·Application pending·0 cites
- 4338US10070536B2Manufacturing method of circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Sep 4, 2018·0 cites·7 claims
- 4436US9917046B2Manufacturing method of a circuit board having a glass filmUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Mar 13, 2018·0 cites·9 claims
- 4536US2007207687A1Method for producing artificial leatherSAN FANG CHEMICAL INDUSTRY CO·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chien-Te Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →