Inventor · disambiguated record
Chunlin Xie
Also filed as: XIE CHUNLIN
8 granted patents·3 pending applications·3 citations·filing 2010–2025
75Inventor score
Top patents by PatentIndex Score
11 records- 0168US8859315B2Epitaxial wafer and manufacturing method thereofBYD CO LTD·Filed 2012·Granted Oct 14, 2014·1 cites·5 claims
- 0265US11578251B2Amphiphilic block polymer ultralow-permeability agent and intelligent temporary plugging type water-based drilling fluidUNIV CHINA PETROLEUM BEIJING·Filed 2022·Granted Feb 14, 2023·0 cites·4 claims
- 0361US8324634B2Epitaxial wafer and manufacturing method thereofSU XILIN·Filed 2010·Granted Dec 4, 2012·1 cites·9 claims
- 0460US2022049148A1Amphiphilic block polymer ultralow-permeability agent and intelligent temporary plugging type water-based drilling fluidUNIV CHINA PETROLEUM BEIJING·Filed 2021·Application pending·0 cites
- 0558US2025341020A1Silicon carbide epitaxial wafer, and preparation method therefor and use thereofBYD CO LTD·Filed 2025·Application pending·0 cites
- 0656US9093596B2Epitaxial wafer for light emitting diode, light emitting diode chip and methods for manufacturing the sameHUO DONGMING·Filed 2012·Granted Jul 28, 2015·1 cites·11 claims
- 0751US12071585B2Self-repairing plugging gel polymer for drilling fluid, preparation method and application thereof, and drilling fluid containing gel polymerUNIV CHINA PETROLEUM BEIJING·Filed 2021·Granted Aug 27, 2024·0 cites·17 claims
- 0841US8723188B2Light emitting diode and method for preparing the sameXIE CHUNLIN·Filed 2012·Granted May 13, 2014·0 cites·10 claims
- 0937US8932892B2Epitaxiay wafer, method for manufacturing the same and method for manufacturing LED chipZHANG WANG·Filed 2012·Granted Jan 13, 2015·0 cites·18 claims
- 1035US2012261702A1Led, led chip and method of forming the sameSU XILIN·Filed 2012·Application pending·0 cites
- 1132US8928006B2Substrate structure, method of forming the substrate structure and chip comprising the substrate structureXIE CHUNLIN·Filed 2012·Granted Jan 6, 2015·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →