Inventor · disambiguated record
Chih-Kuei Yang
Also filed as: YANG CHIH-KUEI
1 granted patent·1 pending application·0 citations·filing 2011–2012
11Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0128US8373265B2Package substrate having a through hole and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2011·Granted Feb 12, 2013·0 cites·11 claims
- 0221US2012314377A1Packaging structure embedded with electronic elements and method of fabricating the sameLAI CHIEN-KUANG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →