Inventor · disambiguated record
Chin-Wei Yang
Also filed as: YANG CHIN-AN · YANG CHIN-WEI
5 granted patents·3 pending applications·1 citations·filing 2003–2021
60Inventor score
Top patents by PatentIndex Score
8 records- 0159US10083899B2Semiconductor package with heat slug and rivet free die attach areaINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 25, 2018·1 cites·14 claims
- 0248US12094244B2Method for recognizing masked faces, device for recognizing masked faces, and computer storage mediumHONGFUJIN PREC IND WUHAN·Filed 2021·Granted Sep 17, 2024·0 cites·12 claims
- 0347US11922724B2Face recognition method utilizing a face recognition model and a face sample library to detect mask imagesHONGFUJIN PREC IND WUHAN·Filed 2020·Granted Mar 5, 2024·0 cites·17 claims
- 0447US2008124485A1Method of successively depositing multi-film releasing plasma chargeUNITED MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 0543US2022327862A1Method for detecting whether a face is masked, masked-face recognition device, and computer storage mediumHONGFUJIN PREC IND WUHAN·Filed 2021·Application pending·0 cites
- 0639US11036971B2Face recognition method and electronic device employing the methodHONGFUJIN PREC IND WUHAN·Filed 2019·Granted Jun 15, 2021·0 cites·15 claims
- 0736US10915739B2Face recognition device, face recognition method, and computer readable storage mediumHONGFUJIN PREC IND WUHAN·Filed 2019·Granted Feb 9, 2021·0 cites·14 claims
- 0826US2004094826A1Leadframe pakaging apparatus and packaging method thereofFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →