Inventor · disambiguated record
Chin-Chia Yang
Also filed as: YANG CHIN-CHIA
6 granted patents·4 pending applications·2 citations·filing 2019–2024
69Inventor score
Files withUNITED MICROELECTRONICS CORP10
Top patents by PatentIndex Score
10 records- 0185US12014995B2Warpage-reducing semiconductor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 18, 2024·1 cites·8 claims
- 0280US12300633B2Warpage-reducing semiconductor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 0377US11101324B2Memory cell and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 24, 2021·1 cites·9 claims
- 0468US11632889B2Method of forming memory cellUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 18, 2023·0 cites·6 claims
- 0560US2025316621A1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0658US2025125252A1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0757US2025132210A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0856US11462513B2Chip bonding alignment structure, chip bonding structure and methods for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 4, 2022·0 cites·10 claims
- 0951US2023361067A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1046US11094900B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 17, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →