Inventor · disambiguated record
Chia-Ming Yang
Also filed as: YANG CHIA-MING
35 granted patents·20 pending applications·196 citations·filing 2000–2024
96Inventor score
Files withORIENT SEMICONDUCTOR ELECT LTD10ORIENT SEMICONDUCTOR ELECTRONICS LTD8MSTAR SEMICONDUCTOR INC5TAIWAN SEMICONDUCTOR MFG5UNIV CHANG GUNG4
Top patents by PatentIndex Score
55 records- 0187US10663042B2External circulation ball screwHIWIN TECH CORP·Filed 2018·Granted May 26, 2020·4 cites·3 claims
- 0287US7948772B2Memory card with electrostatic discharge protection and manufacturing method thereofORIENT SEMICONDUCTOR ELECT LTD·Filed 2009·Granted May 24, 2011·34 cites·19 claims
- 0385US11355356B1Manufacturing method of semiconductor package comprising heat spreaderORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Jun 7, 2022·3 cites·4 claims
- 0481US10612632B2Ball screw structure with detection functionHIWIN TECH CORP·Filed 2018·Granted Apr 7, 2020·4 cites·5 claims
- 0580US7471339B2High-speed video signal processing systemMSTAR SEMICONDUCTOR INC·Filed 2005·Granted Dec 30, 2008·13 cites·10 claims
- 0679US10685852B2Chip packaging device and alignment bonding method thereofUNIV NAT CHENG KUNG·Filed 2018·Granted Jun 16, 2020·4 cites·5 claims
- 0777US10520069B2Ball screwHIWIN TECH CORP·Filed 2018·Granted Dec 31, 2019·2 cites·5 claims
- 0874US7084795B2Video signal processing system with a dynamic ADC calibration loop and related methodsMSTAR SEMICONDUCTOR INC·Filed 2005·Granted Aug 1, 2006·9 cites·19 claims
- 0973US8041845B2Method for detecting digital video interface off-line mode and associated receiverMSTAR SEMICONDUCTOR INC·Filed 2008·Granted Oct 18, 2011·7 cites·22 claims
- 1072US6634930B1Method and apparatus for preventing metal corrosion during chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 21, 2003·14 cites·7 claims
- 1171USD647097SMemory cardORIENT SEMICONDUCTOR ELECT LTD·Filed 2010·Granted Oct 18, 2011·21 cites·1 claims
- 1269US9205529B2Dispenser for chemical-mechanical polishing (CMP) apparatus, CMP apparatus having the dispenser, and CMP process using the CMP apparatusHAM LIANG-CHUO·Filed 2011·Granted Dec 8, 2015·6 cites·8 claims
- 1368US7106231B2Video signal processing system including analog to digital converter and related method for calibrating analog to digital converterMSTAR SEMICONDUCTOR INC·Filed 2004·Granted Sep 12, 2006·15 cites·18 claims
- 1465US7544606B2Method to implement stress free polishingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 9, 2009·2 cites·19 claims
- 1562USD647096SMemory cardORIENT SEMICONDUCTOR ELECT LTD·Filed 2010·Granted Oct 18, 2011·14 cites·1 claims
- 1662US7973308B2Organic-semiconductor-based infrared receiving deviceUNIV NAT CHIAO TUNG·Filed 2009·Granted Jul 5, 2011·1 cites·10 claims
- 1762US7115978B2Package StructureORIENT SEMICONDUCTOR ELECT LTD·Filed 2004·Granted Oct 3, 2006·12 cites·6 claims
- 1861US7346038B2Method for generating 2D OVSF codes in multicarrier DS-CDMA systemsACCTON TECHNOLOGY CORP·Filed 2003·Granted Mar 18, 2008·6 cites·20 claims
- 1956US6897147B1Solution for copper hillock induced by thermal strain with buffer zone for strain relaxationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 24, 2005·8 cites·19 claims
- 2056US2025125216A1Die and manufacturing method thereof as well as semiconductor package with the sameORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 2155US11215399B2High temperature reaction systemUNIV NAT CHENG KUNG·Filed 2019·Granted Jan 4, 2022·0 cites·10 claims
- 2254US7394147B2Semiconductor packageORIENT SEMICONDUCTOR ELECT LTD·Filed 2005·Granted Jul 1, 2008·1 cites·13 claims
- 2354US2025062265A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 2453US2025062281A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 2552US11583848B2Nanoparticle control and detection system and operating method thereofUNIV CHANG GUNG·Filed 2019·Granted Feb 21, 2023·0 cites·8 claims
- 2651US10473613B2Light-addressable potentiometric sensing unitsUNIV CHANG GUNG·Filed 2016·Granted Nov 12, 2019·0 cites·10 claims
- 2750US6847111B2Semiconductor device with heat-dissipating capabilityORIENT SEMICONDUCTOR ELECT LTD·Filed 2003·Granted Jan 25, 2005·8 cites·5 claims
- 2850US6733373B1Polishing assembly for a linear chemical mechanical polishing apparatus and method for formingTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted May 11, 2004·6 cites·13 claims
- 2948US10551340B2Capacitor-based fluid sensing units and operating methods thereofUNIV CHANG GUNG·Filed 2017·Granted Feb 4, 2020·0 cites·8 claims
- 3048US7197007B2Method for generating 2D OVSF codes in multicarrier DS-CDMA systemsACCTON TECHNOLOGY CORP·Filed 2002·Granted Mar 27, 2007·2 cites·13 claims
- 3148US2009253230A1Method for manufacturing stack chip package structureTUNG YUEH-MING·Filed 2009·Application pending·0 cites
- 3247US2009189295A1Stack chip package structure and manufacturing method thereofORIENT SEMICONDUCTOR ELECT LTD·Filed 2008·Application pending·0 cites
- 3346US11462454B2Semiconductor package comprising heat spreader and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Oct 4, 2022·0 cites·6 claims
- 3446US2010133434A1Organic semiconductor infrared distance sensing apparatus and organic infrared emitting apparatus thereofUNIV NAT CHIAO TUNG·Filed 2009·Application pending·0 cites
- 3545US11462485B2Electronic package including electromagnetic shielding structure and method of manufactureORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Oct 4, 2022·0 cites·11 claims
- 3645US9053928B2Wafer and film coating method of using the sameINOTERA MEMORIES INC·Filed 2014·Granted Jun 9, 2015·0 cites·18 claims
- 3744US2006097129A1Lens module structureSUN KUO-YANG·Filed 2004·Application pending·0 cites
- 3843US2021005574A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2020·Application pending·0 cites
- 3942US8410530B2Sensitive field effect transistor apparatusLAI CHAO-SUNG·Filed 2009·Granted Apr 2, 2013·0 cites·2 claims
- 4041US2007032180A1Slurry residence time enhancement systemTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 4141US2020371056A1Gas sensing device and manufacturing method thereofUNIV CHANG GUNG·Filed 2019·Application pending·0 cites
- 4241US2008113472A1Film and chip packaging process using the sameTUNG YUEH MING·Filed 2007·Application pending·0 cites
- 4340US11426793B2Method of fabricating high-power moduleUNIV NAT CHENG KUNG·Filed 2018·Granted Aug 30, 2022·0 cites·16 claims
- 4440US2006190632A1Method for detecting DVI off-line mode and associated DVI receiverMSTAR SEMICONDUCTOR INC·Filed 2005·Application pending·0 cites
- 4539US2007205493A1Semiconductor package structure and method for manufacturing the sameORIENT SEMICONDUCTOR ELECT LTD·Filed 2006·Application pending·0 cites
- 4639US2022285217A1Wafer thinning methodORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Application pending·0 cites
- 4739US2008007932A1Memory card with electrostatic discharge protectionORIENT SEMICONDUCTOR ELECT LTD·Filed 2006·Application pending·0 cites
- 4837US9105505B2Memory cell having a recessed gate and manufacturing method thereofINOTERA MEMORIES INC·Filed 2013·Granted Aug 11, 2015·0 cites·19 claims
- 4937US2005059233A1Process for forming metal damascene structure to prevent dielectric layer peelingFiled 2003·Application pending·0 cites
- 5035US2013234280A1Shallow trench isolation in dynamic random access memory and manufacturing method thereofKUMAR ARVIND·Filed 2012·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →