Inventor · disambiguated record
Chih-Chao Yang
Also filed as: YANG CHIH-CHAO
898 granted patents·193 pending applications·5,366 citations·filing 1994–2024
99Inventor score
Top patents by PatentIndex Score
1,091 records- 0199US9941241B2Method for wafer-wafer bondingIBM·Filed 2016·Granted Apr 10, 2018·219 cites·13 claims
- 0299US9496239B1Nitride-enriched oxide-to-oxide 3D wafer bondingIBM·Filed 2015·Granted Nov 15, 2016·243 cites·20 claims
- 0399US8482132B2Pad bonding employing a self-aligned plated liner for adhesion enhancementYANG CHIH-CHAO·Filed 2009·Granted Jul 9, 2013·237 cites·6 claims
- 0499US7397260B2Structure and method for monitoring stress-induced degradation of conductive interconnectsIBM·Filed 2005·Granted Jul 8, 2008·169 cites·12 claims
- 0598US11107731B1Self-aligned repaired top viaIBM·Filed 2020·Granted Aug 31, 2021·5 cites·20 claims
- 0698US11024577B1Embedded anti-fuses for small scale applicationsIBM·Filed 2020·Granted Jun 1, 2021·8 cites·15 claims
- 0798US10707413B1Formation of embedded magnetic random-access memory devicesIBM·Filed 2019·Granted Jul 7, 2020·46 cites·20 claims
- 0898US10319629B1Skip via for metal interconnectsIBM·Filed 2018·Granted Jun 11, 2019·25 cites·20 claims
- 0998US9793156B1Self-aligned low resistance metallic interconnect structuresIBM·Filed 2016·Granted Oct 17, 2017·29 cites·20 claims
- 1098US9768118B1Contact having self-aligned air gap spacersIBM·Filed 2016·Granted Sep 19, 2017·29 cites·10 claims
- 1198US9748169B1Treating copper interconnectsIBM·Filed 2016·Granted Aug 29, 2017·21 cites·11 claims
- 1298US9640509B1Advanced metal-to-metal direct bondingIBM·Filed 2016·Granted May 2, 2017·33 cites·20 claims
- 1398US8785284B1FinFETs and fin isolation structuresIBM·Filed 2013·Granted Jul 22, 2014·34 cites·18 claims
- 1498US8546209B1Replacement metal gate processing with reduced interlevel dielectric layer etch rateCHENG KANGGUO·Filed 2012·Granted Oct 1, 2013·35 cites·20 claims
- 1598US7557424B2Reversible electric fuse and antifuse structures for semiconductor devicesIBM·Filed 2007·Granted Jul 7, 2009·75 cites·16 claims
- 1697US10534276B1Lithographic photomask alignment using non-planar alignment structures formed on waferIBM·Filed 2019·Granted Jan 14, 2020·11 cites·16 claims
- 1797US10529622B1Void-free metallic interconnect structures with self-formed diffusion barrier layersIBM·Filed 2018·Granted Jan 7, 2020·16 cites·20 claims
- 1897US10529663B1Copper interconnect with filled voidIBM·Filed 2018·Granted Jan 7, 2020·22 cites·20 claims
- 1997US10204829B1Low-resistivity metallic interconnect structures with self-forming diffusion barrier layersIBM·Filed 2018·Granted Feb 12, 2019·21 cites·13 claims
- 2097US9859215B1Formation of advanced interconnectsIBM·Filed 2016·Granted Jan 2, 2018·17 cites·14 claims
- 2197US9859218B1Selective surface modification of interconnect structuresIBM·Filed 2016·Granted Jan 2, 2018·16 cites·11 claims
- 2297US9786603B1Surface nitridation in metal interconnectsIBM·Filed 2016·Granted Oct 10, 2017·14 cites·13 claims
- 2397US9716038B2Critical dimension shrink through selective metal growth on metal hardmask sidewallsIBM·Filed 2016·Granted Jul 25, 2017·12 cites·1 claims
- 2497US9716063B1Cobalt top layer advanced metallization for interconnectsIBM·Filed 2016·Granted Jul 25, 2017·13 cites·8 claims
- 2597US9437714B1Selective gate contact fill metallizationIBM·Filed 2015·Granted Sep 6, 2016·23 cites·16 claims
- 2697US9349691B2Semiconductor device with reduced via resistanceIBM·Filed 2014·Granted May 24, 2016·18 cites·10 claims
- 2797US9276013B1Integrated formation of Si and SiGe finsIBM·Filed 2015·Granted Mar 1, 2016·21 cites·20 claims
- 2897US9157136B2Multi-element alloy material and method of manufacturing the sameIND TECH RES INST·Filed 2012·Granted Oct 13, 2015·29 cites·11 claims
- 2997US8420531B2Enhanced diffusion barrier for interconnect structuresYANG CHIH-CHAO·Filed 2011·Granted Apr 16, 2013·29 cites·20 claims
- 3097US8299625B2Borderless interconnect line structure self-aligned to upper and lower level contact viasPONOTH SHOM·Filed 2010·Granted Oct 30, 2012·45 cites·11 claims
- 3197US8039966B2Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnectsIBM·Filed 2009·Granted Oct 18, 2011·54 cites·26 claims
- 3297US7531407B2Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating sameIBM·Filed 2006·Granted May 12, 2009·61 cites·11 claims
- 3397US7528066B2Structure and method for metal integrationIBM·Filed 2006·Granted May 5, 2009·50 cites·14 claims
- 3496US11881431B2Anti-fuse with laterally extended linerIBM·Filed 2021·Granted Jan 23, 2024·3 cites·16 claims
- 3596US10224242B1Low-resistivity metallic interconnect structuresIBM·Filed 2017·Granted Mar 5, 2019·15 cites·20 claims
- 3696US10141391B2Microstructure modulation for 3D bonded semiconductor containing an embedded resistor structureIBM·Filed 2017·Granted Nov 27, 2018·16 cites·20 claims
- 3796US9859157B1Method for forming improved liner layer and semiconductor device including the sameIBM·Filed 2016·Granted Jan 2, 2018·11 cites·17 claims
- 3896US9786553B1Advanced BEOL interconnect structure containing uniform air gapsIBM·Filed 2016·Granted Oct 10, 2017·13 cites·15 claims
- 3996US9754883B1Hybrid metal interconnects with a bamboo grain microstructureIBM·Filed 2016·Granted Sep 5, 2017·14 cites·14 claims
- 4096US9691659B1Via and chamfer control for advanced interconnectsIBM·Filed 2016·Granted Jun 27, 2017·14 cites·20 claims
- 4196US9620479B13D bonded semiconductor structure with an embedded resistorIBM·Filed 2016·Granted Apr 11, 2017·14 cites·20 claims
- 4296US9379221B1Bottom-up metal gate formation on replacement metal gate finFET devicesIBM·Filed 2015·Granted Jun 28, 2016·15 cites·14 claims
- 4396US9177820B2Sub-lithographic semiconductor structures with non-constant pitchIBM·Filed 2012·Granted Nov 3, 2015·20 cites·12 claims
- 4496US8906807B2Single fin cut employing angled processing methodsIBM·Filed 2012·Granted Dec 9, 2014·23 cites·20 claims
- 4596US8492274B2Metal alloy cap integrationIBM·Filed 2012·Granted Jul 23, 2013·19 cites·9 claims
- 4696US7867832B2Electrical fuse and method of makingIBM·Filed 2008·Granted Jan 11, 2011·31 cites·19 claims
- 4796US7727888B2Interconnect structure and method for forming the sameIBM·Filed 2005·Granted Jun 1, 2010·50 cites·14 claims
- 4896US7514271B2Method of forming high density planar magnetic domain wall memoryIBM·Filed 2007·Granted Apr 7, 2009·36 cites·10 claims
- 4996US7394273B2On-chip electromigration monitoring systemIBM·Filed 2006·Granted Jul 1, 2008·31 cites·7 claims
- 5096US7283410B2Real-time adaptive SRAM array for high SEU immunityIBM·Filed 2006·Granted Oct 16, 2007·52 cites·20 claims
Showing the top 50 of 1,091 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →