Inventor · disambiguated record
Cheng Yang
Also filed as: YANG CHENG · YANG CHENG-LING
23 granted patents·4 pending applications·107 citations·filing 2007–2023
93Inventor score
Top patents by PatentIndex Score
27 records- 0198US11189622B1Semiconductor device with graphene layer and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Nov 30, 2021·10 cites·18 claims
- 0296US8017183B2Organosiloxane materials for selective area deposition of inorganic materialsEASTMAN KODAK CO·Filed 2007·Granted Sep 13, 2011·39 cites·20 claims
- 0392US10896877B1System in package with double side mounted boardFLEX LTD·Filed 2018·Granted Jan 19, 2021·9 cites·11 claims
- 0491US8030212B2Process for selective area deposition of inorganic materialsEASTMAN KODAK CO·Filed 2007·Granted Oct 4, 2011·19 cites·24 claims
- 0589US10629561B2Overlapping stacked die package with vertical columnsINTEL CORP·Filed 2019·Granted Apr 21, 2020·6 cites·6 claims
- 0687US7846644B2Photopatternable deposition inhibitor containing siloxaneEASTMAN KODAK CO·Filed 2007·Granted Dec 7, 2010·10 cites·17 claims
- 0783US11682603B2Control of thermal interface material in multi-chip packageFLEX LTD·Filed 2021·Granted Jun 20, 2023·1 cites·20 claims
- 0879US11270974B2Embedded copper structure for microelectronics packageFLEX LTD·Filed 2019·Granted Mar 8, 2022·2 cites·19 claims
- 0974US11723151B2Methods of creating exposed cavities in molded electronic devicesFLEX LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 1074US10620221B2Devices and assays for diagnosis of sinusitisENTVANTAGE DIAGNOSTICS INC·Filed 2017·Granted Apr 14, 2020·3 cites·22 claims
- 1174US10256208B2Overlapping stacked die package with vertical columnsINTEL CORP·Filed 2014·Granted Apr 9, 2019·3 cites·5 claims
- 1273US2024040703A1Methods of creating exposed cavities in molded electronic devicesFLEX LTD·Filed 2023·Application pending·0 cites
- 1371US8129098B2Colored mask combined with selective area depositionIRVING LYN M·Filed 2007·Granted Mar 6, 2012·5 cites·15 claims
- 1465US11521978B2Semiconductor device and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Dec 6, 2022·0 cites·8 claims
- 1563US11304302B2Methods of creating exposed cavities in molded electronic devicesFLEX LTD·Filed 2019·Granted Apr 12, 2022·0 cites·15 claims
- 1663US2022238482A1Embedded copper structure for microelectronics packageFLEX LTD·Filed 2022·Application pending·0 cites
- 1757US11114448B2Semiconductor device and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Sep 7, 2021·0 cites·8 claims
- 1856US12237209B2Method of manufacturing memory device having active area in elongated blockNANYA TECHNOLOGY CORP·Filed 2022·Granted Feb 25, 2025·0 cites·10 claims
- 1956US11699734B2Semiconductor device with resistance reduction element and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Jul 11, 2023·0 cites·5 claims
- 2055US12278138B2Method of manufacturing memory device with first and second isolation members using patterned photoresist layer and energy-decomposable maskNANYA TECHNOLOGY CORP·Filed 2022·Granted Apr 15, 2025·0 cites·14 claims
- 2155US11652151B2Semiconductor device structure with fine conductive contact and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted May 16, 2023·0 cites·6 claims
- 2255US2025030241A1Finite control set model prediction control method of llcl battery energy storage converterUNIV SHANGHAI MARITIME·Filed 2023·Application pending·0 cites
- 2354US12243850B2Devices, systems, and methods for stacked die packagesFLEX LTD·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 2453US11114536B1Semiconductor device having multiple dimensions of gate structures and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 7, 2021·0 cites·19 claims
- 2549US12368324B2Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip packageUNIV ZHEJIANG·Filed 2023·Granted Jul 22, 2025·0 cites·8 claims
- 2646US9936582B2Integrated circuit assemblies with molding compoundINTEL CORP·Filed 2014·Granted Apr 3, 2018·0 cites·20 claims
- 2742US2008084709A1Light Guide Plate and Back-Light Module Having Light Guide PlateIND TECH RES INST·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →